SPRSP93 November   2024 F29H850TU , F29H859TU-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Analog Signals
      2. 5.3.2 Digital Signals
      3. 5.3.3 Power and Ground
      4. 5.3.4 Test, JTAG, and Reset
    4. 5.4 Pins With Internal Pullup and Pulldown
    5. 5.5 Pin Multiplexing
      1. 5.5.1 GPIO Muxed Pins
    6. 5.6 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  F29H85x ESD Ratings – Commercial
    3. 6.3  F29H85x ESD Ratings – Automotive
    4. 6.4  F29P58x ESD Ratings – Commercial
    5. 6.5  F29P58x ESD Ratings – Automotive
    6. 6.6  Recommended Operating Conditions
    7. 6.7  Power Consumption Summary
      1. 6.7.1 System Current Consumption VREG Enabled
      2. 6.7.2 System Current Consumption VREG Disable - External Supply
      3. 6.7.3 Operating Mode Test Description
      4. 6.7.4 Reducing Current Consumption
        1. 6.7.4.1 Typical Current Reduction per Disabled Peripheral
    8. 6.8  Electrical Characteristics
    9. 6.9  Thermal Resistance Characteristics for ZEX Package
    10. 6.10 Thermal Resistance Characteristics for PTS Package
    11. 6.11 Thermal Resistance Characteristics for RFS Package
    12. 6.12 Thermal Resistance Characteristics for PZS Package
    13. 6.13 Thermal Design Considerations
    14. 6.14 System
      1. 6.14.1  Power Management Module (PMM)
        1. 6.14.1.1 Introduction
        2. 6.14.1.2 Overview
          1. 6.14.1.2.1 Power Rail Monitors
            1. 6.14.1.2.1.1 I/O POR (Power-On Reset) Monitor
            2. 6.14.1.2.1.2 I/O BOR (Brown-Out Reset) Monitor
            3. 6.14.1.2.1.3 VDD POR (Power-On Reset) Monitor
          2. 6.14.1.2.2 External Supervisor Usage
          3. 6.14.1.2.3 Delay Blocks
          4. 6.14.1.2.4 Internal 1.2-V LDO Voltage Regulator (VREG)
          5. 6.14.1.2.5 VREGENZ
        3. 6.14.1.3 External Components
          1. 6.14.1.3.1 Decoupling Capacitors
            1. 6.14.1.3.1.1 VDDIO Decoupling
            2. 6.14.1.3.1.2 VDD Decoupling
        4. 6.14.1.4 Power Sequencing
          1. 6.14.1.4.1 Supply Pins Ganging
          2. 6.14.1.4.2 Signal Pins Power Sequence
          3. 6.14.1.4.3 Supply Pins Power Sequence
            1. 6.14.1.4.3.1 External VREG/VDD Mode Sequence
            2. 6.14.1.4.3.2 Internal VREG/VDD Mode Sequence
            3. 6.14.1.4.3.3 Supply Sequencing Summary and Effects of Violations
            4. 6.14.1.4.3.4 Supply Slew Rate
        5. 6.14.1.5 Power Management Module Electrical Data and Timing
          1. 6.14.1.5.1 Power Management Module Operating Conditions
          2. 6.14.1.5.2 Power Management Module Characteristics
      2. 6.14.2  Reset Timing
        1. 6.14.2.1 Reset Sources
        2. 6.14.2.2 Reset Electrical Data and Timing
          1. 6.14.2.2.1 Reset XRSn Timing Requirements
          2. 6.14.2.2.2 Reset XRSn Switching Characteristics
          3. 6.14.2.2.3 Reset Timing Diagrams
      3. 6.14.3  Clock Specifications
        1. 6.14.3.1 Clock Sources
        2. 6.14.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 6.14.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. 6.14.3.2.1.1 Input Clock Frequency
            2. 6.14.3.2.1.2 XTAL Oscillator Characteristics
            3. 6.14.3.2.1.3 X1 Input Level Characteristics When Using an External Clock Source Not a Crystal
            4. 6.14.3.2.1.4 X1 Timing Requirements
            5. 6.14.3.2.1.5 AUXCLKIN Timing Requirements
            6. 6.14.3.2.1.6 APLL Characteristics
            7. 6.14.3.2.1.7 XCLKOUT Switching Characteristics PLL Bypassed or Enabled
        3. 6.14.3.3 Input Clocks
        4. 6.14.3.4 XTAL Oscillator
          1. 6.14.3.4.1 Introduction
          2. 6.14.3.4.2 Overview
            1. 6.14.3.4.2.1 Electrical Oscillator
              1. 6.14.3.4.2.1.1 Modes of Operation
                1. 6.14.3.4.2.1.1.1 Crystal Mode of Operation
                2. 6.14.3.4.2.1.1.2 Single-Ended Mode of Operation
              2. 6.14.3.4.2.1.2 XTAL Output on XCLKOUT
            2. 6.14.3.4.2.2 Quartz Crystal
            3. 6.14.3.4.2.3 GPIO Modes of Operation
          3. 6.14.3.4.3 Functional Operation
            1. 6.14.3.4.3.1 ESR – Effective Series Resistance
            2. 6.14.3.4.3.2 Rneg – Negative Resistance
            3. 6.14.3.4.3.3 Start-up Time
            4. 6.14.3.4.3.4 DL – Drive Level
          4. 6.14.3.4.4 How to Choose a Crystal
          5. 6.14.3.4.5 Testing
          6. 6.14.3.4.6 Common Problems and Debug Tips
          7. 6.14.3.4.7 Crystal Oscillator Specifications
            1. 6.14.3.4.7.1 Crystal Oscillator Electrical Characteristics
            2. 6.14.3.4.7.2 Crystal Equivalent Series Resistance (ESR) Requirements
            3. 6.14.3.4.7.3 Crystal Oscillator Parameters
            4. 6.14.3.4.7.4 Crystal Oscillator Electrical Characteristics
        5. 6.14.3.5 Internal Oscillators
          1. 6.14.3.5.1 INTOSC Characteristics
      4. 6.14.4  Flash Parameters
        1. 6.14.4.1 Flash Parameters 
      5. 6.14.5  Memory Subsystem (MEMSS)
        1. 6.14.5.1 Introduction
        2. 6.14.5.2 Features
        3. 6.14.5.3 RAM Specifications
      6. 6.14.6  Debug/JTAG
        1. 6.14.6.1 JTAG Electrical Data and Timing
          1. 6.14.6.1.1 DEBUGSS Timing Requirements
          2. 6.14.6.1.2 DEBUGSS Switching Characteristics
          3. 6.14.6.1.3 JTAG Timing Diagram
          4. 6.14.6.1.4 SWD Timing Diagram
      7. 6.14.7  GPIO Electrical Data and Timing
        1. 6.14.7.1 GPIO – Output Timing
          1. 6.14.7.1.1 General-Purpose Output Switching Characteristics
          2. 6.14.7.1.2 General-Purpose Output Timing Diagram
        2. 6.14.7.2 GPIO – Input Timing
          1. 6.14.7.2.1 General-Purpose Input Timing Requirements
          2. 6.14.7.2.2 Sampling Mode
        3. 6.14.7.3 Sampling Window Width for Input Signals
      8. 6.14.8  Real-Time Direct Memory Access (RTDMA)
        1. 6.14.8.1 Introduction
          1. 6.14.8.1.1 Features
          2. 6.14.8.1.2 Block Diagram
      9. 6.14.9  Low-Power Modes
        1. 6.14.9.1 Clock-Gating Low-Power Modes
        2. 6.14.9.2 Low-Power Mode Wake-up Timing
          1. 6.14.9.2.1 IDLE Mode Timing Requirements
          2. 6.14.9.2.2 IDLE Mode Switching Characteristics
          3. 6.14.9.2.3 IDLE Entry and Exit Timing Diagram
          4. 6.14.9.2.4 STANDBY Mode Timing Requirements
          5. 6.14.9.2.5 STANDBY Mode Switching Characteristics
          6. 6.14.9.2.6 STANDBY Entry and Exit Timing Diagram
      10. 6.14.10 External Memory Interface (EMIF)
        1. 6.14.10.1 Asynchronous Memory Support
        2. 6.14.10.2 Synchronous DRAM Support
        3. 6.14.10.3 EMIF Electrical Data and Timing
          1. 6.14.10.3.1 EMIF Synchronous Memory Timing Requirements
          2. 6.14.10.3.2 EMIF Synchronous Memory Switching Characteristics
          3. 6.14.10.3.3 EMIF Synchronous Memory Timing Diagrams
          4. 6.14.10.3.4 EMIF Asynchronous Memory Timing Requirements
          5. 6.14.10.3.5 EMIF Asynchronous Memory Switching Characteristics
          6. 6.14.10.3.6 EMIF Asynchronous Memory Timing Diagrams
    15. 6.15 C29x Analog Peripherals
      1. 6.15.1 Analog Subsystem
        1. 6.15.1.1 Features
        2. 6.15.1.2 Block Diagram
        3. 6.15.1.3 Analog Pin Connections
      2. 6.15.2 Analog-to-Digital Converter (ADC)
        1. 6.15.2.1 ADC Configurability
          1. 6.15.2.1.1 Signal Mode
        2. 6.15.2.2 ADC Electrical Data and Timing
          1. 6.15.2.2.1  ADC Operating Conditions 12-bit Single-Ended
          2. 6.15.2.2.2  ADC Operating Conditions 12-bit Differential
          3. 6.15.2.2.3  ADC Operating Conditions 16-bit Single-Ended
          4. 6.15.2.2.4  ADC Operating Conditions 16-bit Differential
          5. 6.15.2.2.5  ADC Timing Requirements
          6. 6.15.2.2.6  ADC Characteristics 12-bit Single-Ended
          7. 6.15.2.2.7  ADC Characteristics 12-bit Differential
          8. 6.15.2.2.8  ADC Characteristics 16-bit Single-Ended
          9. 6.15.2.2.9  ADC Characteristics 16-bit Differential
          10. 6.15.2.2.10 ADC INL and DNL
          11. 6.15.2.2.11 ADC Input Model Models
          12. 6.15.2.2.12 ADC Timing Diagrams
      3. 6.15.3 Temperature Sensor
        1. 6.15.3.1 Temperature Sensor Electrical Data and Timing
          1. 6.15.3.1.1 Temperature Sensor Characteristics
      4. 6.15.4 Comparator Subsystem (CMPSS)
        1. 6.15.4.1 CMPSS Connectivity Diagram
        2. 6.15.4.2 Block Diagram
        3. 6.15.4.3 CMPSS Electrical Data and Timing
          1. 6.15.4.3.1 Comparator Electrical Characteristics
          2.        CMPSS Comparator Input Referred Offset and Hysteresis
          3. 6.15.4.3.2 CMPSS DAC Static Electrical Characteristics
          4. 6.15.4.3.3 CMPSS Illustrative Graphs
      5. 6.15.5 Buffered Digital-to-Analog Converter (DAC)
        1. 6.15.5.1 Buffered DAC Electrical Data and Timing
          1. 6.15.5.1.1 Buffered DAC Operating Conditions
          2. 6.15.5.1.2 Buffered DAC Electrical Characteristics
    16. 6.16 C29x Control Peripherals
      1. 6.16.1 Enhanced Capture (eCAP)
        1. 6.16.1.1 eCAP Block Diagram
        2. 6.16.1.2 eCAP Synchronization
        3. 6.16.1.3 eCAP Electrical Data and Timing
          1. 6.16.1.3.1 eCAP Timing Requirements
          2. 6.16.1.3.2 eCAP Switching Characteristics
      2. 6.16.2 High-Resolution Capture (HRCAP)
        1. 6.16.2.1 eCAP and HRCAP Block Diagram
        2. 6.16.2.2 HRCAP Electrical Data and Timing
          1. 6.16.2.2.1 HRCAP Switching Characteristics
          2. 6.16.2.2.2 HRCAP Figure and Graph
      3. 6.16.3 Enhanced Pulse Width Modulator (ePWM)
        1. 6.16.3.1 Control Peripherals Synchronization
        2. 6.16.3.2 ePWM Electrical Data and Timing
          1. 6.16.3.2.1 ePWM Timing Requirements
          2. 6.16.3.2.2 ePWM Switching Characteristics
          3. 6.16.3.2.3 Trip-Zone Input Timing
            1. 6.16.3.2.3.1 PWM Hi-Z Characteristics Timing Diagram
      4. 6.16.4 External ADC Start-of-Conversion Electrical Data and Timing
        1. 6.16.4.1 External ADC Start-of-Conversion Switching Characteristics
        2. 6.16.4.2 ADCSOCAO or ADCSOCBO Timing Diagram
      5. 6.16.5 High-Resolution Pulse Width Modulator (HRPWM)
        1. 6.16.5.1 HRPWM Electrical Data and Timing
          1. 6.16.5.1.1 High-Resolution PWM Characteristics
      6. 6.16.6 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 6.16.6.1 eQEP Electrical Data and Timing
          1. 6.16.6.1.1 eQEP Timing Requirements
          2. 6.16.6.1.2 eCAP Switching Characteristics
      7. 6.16.7 Sigma-Delta Filter Module (SDFM)
        1. 6.16.7.1 SDFM Electrical Data and Timing
          1. 6.16.7.1.1 SDFM Electrical Data and Timing (Synchronized GPIO)
          2. 6.16.7.1.2 SDFM Electrical Data and Timing (Using ASYNC)
            1. 6.16.7.1.2.1 SDFM Timing Requirements When Using Asynchronous GPIO ASYNC Option
            2. 6.16.7.1.2.2 SDFM Timing Requirements When Using Synchronous GPIO SYNC Option
          3. 6.16.7.1.3 SDFM Timing Diagram
    17. 6.17 C29x Communications Peripherals
      1. 6.17.1 Modular Controller Area Network (MCAN)
      2. 6.17.2 Fast Serial Interface (FSI)
        1. 6.17.2.1 FSI Transmitter
          1. 6.17.2.1.1 FSITX Electrical Data and Timing
            1. 6.17.2.1.1.1 FSITX Switching Characteristics
            2. 6.17.2.1.1.2 FSITX Timings
        2. 6.17.2.2 FSI Receiver
          1. 6.17.2.2.1 FSIRX Electrical Data and Timing
            1. 6.17.2.2.1.1 FSIRX Timing Requirements
            2. 6.17.2.2.1.2 FSIRX Switching Characteristics
            3. 6.17.2.2.1.3 FSIRX Timings
        3. 6.17.2.3 FSI SPI Compatibility Mode
          1. 6.17.2.3.1 FSITX SPI Signaling Mode Electrical Data and Timing
            1. 6.17.2.3.1.1 FSITX SPI Signaling Mode Switching Characteristics
            2. 6.17.2.3.1.2 FSITX SPI Signaling Mode Timings
      3. 6.17.3 Inter-Integrated Circuit (I2C)
        1. 6.17.3.1 I2C Electrical Data and Timing
          1. 6.17.3.1.1 I2C Timing Requirements
          2. 6.17.3.1.2 I2C Switching Characteristics
          3. 6.17.3.1.3 I2C Timing Diagram
      4. 6.17.4 Power Management Bus (PMBus) Interface
        1. 6.17.4.1 PMBus Electrical Data and Timing
          1. 6.17.4.1.1 PMBus Electrical Characteristics
          2. 6.17.4.1.2 PMBus Fast Plus Mode Switching Characteristics
          3. 6.17.4.1.3 PMBus Fast Mode Switching Characteristics
          4. 6.17.4.1.4 PMBus Standard Mode Switching Characteristics
      5. 6.17.5 Serial Peripheral Interface (SPI)
        1. 6.17.5.1 SPI Controller Mode Timings
          1. 6.17.5.1.1 SPI Controller Mode Switching Characteristics Clock Phase 0
          2. 6.17.5.1.2 SPI Controller Mode Switching Characteristics Clock Phase 1
          3. 6.17.5.1.3 SPI Controller Mode Timing Requirements
          4. 6.17.5.1.4 SPI Controller Mode Timing Diagrams
        2. 6.17.5.2 SPI Peripheral Mode Timings
          1. 6.17.5.2.1 SPI Peripheral Mode Switching Characteristics
          2. 6.17.5.2.2 SPI Peripheral Mode Timing Requirements
          3. 6.17.5.2.3 SPI Peripheral Mode Timing Diagrams
      6. 6.17.6 Single Edge Nibble Transmission (SENT)
        1. 6.17.6.1 Introduction
        2. 6.17.6.2 Features
      7. 6.17.7 Local Interconnect Network (LIN)
      8. 6.17.8 EtherCAT SubordinateDevice Controller (ESC)
        1. 6.17.8.1 ESC Features
        2. 6.17.8.2 ESC Subsystem Integrated Features
        3. 6.17.8.3 EtherCAT IP Block Diagram
        4. 6.17.8.4 EtherCAT Electrical Data and Timing
          1. 6.17.8.4.1 EtherCAT Timing Requirements
          2. 6.17.8.4.2 EtherCAT Switching Characteristics
          3. 6.17.8.4.3 EtherCAT Timing Diagrams
      9. 6.17.9 Universal Asynchronous Receiver-Transmitter (UART)
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Error Signaling Module (ESM_C29)
      1. 7.3.1 Introduction
      2. 7.3.2 ESM Subsystem
      3. 7.3.3 System ESM
    4. 7.4  Error Aggregator
      1. 7.4.1 Error Aggregator Modules
      2. 7.4.2 Error Aggregator Interface
    5. 7.5  Memory
      1. 7.5.1 C29x Memory Map
      2. 7.5.2 Flash Memory Map
        1. 7.5.2.1 Flash MAIN Region Address Map (F29H85x, 4MB)
        2. 7.5.2.2 Flash MAIN Region Address Map (F29H85x, 2MB)
        3. 7.5.2.3 Flash MAIN Region Address Map (F29P58x, 4MB)
        4. 7.5.2.4 Flash MAIN Region Address Map (F29P58x, 2MB)
        5. 7.5.2.5 Flash MAIN Region Address MAP (F29P58x, 1MB)
        6. 7.5.2.6 Flash Data Bank Address Map
        7. 7.5.2.7 Flash BANKMGMT Region Address Map
        8. 7.5.2.8 Flash SECCFG Region Address Map
      3. 7.5.3 Peripheral Registers Memory Map
    6. 7.6  Identification
    7. 7.7  Boot ROM
      1. 7.7.1 Device Boot Sequence
      2. 7.7.2 Device Boot Modes
        1. 7.7.2.1 Default Boot Modes
        2. 7.7.2.2 Custom Boot Modes
      3. 7.7.3 Device Boot Configurations
        1. 7.7.3.1 Configuring Boot Mode Pins
        2. 7.7.3.2 Configuring Boot Mode Table Options
      4. 7.7.4 Device Boot Flow Diagrams
        1. 7.7.4.1 Device Boot Flow
        2. 7.7.4.2 CPU1 Boot Flow
        3. 7.7.4.3 Emulation Boot Flow
        4. 7.7.4.4 Stand-alone Boot Flow
      5. 7.7.5 GPIO Assignments
    8. 7.8  Security Modules and Cryptographic Accelerators
      1. 7.8.1 Security Modules
        1. 7.8.1.1 Hardware Security Module (HSM)
        2. 7.8.1.2 Cryptographic Accelerators
      2. 7.8.2 Safety and Security Unit (SSU)
        1. 7.8.2.1 System View
    9. 7.9  C29x Subsystem
      1. 7.9.1 C29 CPU Architecture
      2. 7.9.2 Peripheral Interrupt Priority and Expansion (PIPE)
        1. 7.9.2.1 Introduction
          1. 7.9.2.1.1 Features
          2. 7.9.2.1.2 Interrupt Concepts
        2. 7.9.2.2 Interrupt Architecture
          1. 7.9.2.2.1 Dynamic Priority Arbitration Block
          2. 7.9.2.2.2 Post Processing Block
          3. 7.9.2.2.3 Memory Mapped Registers
        3. 7.9.2.3 Interrupt Propagation
      3. 7.9.3 Data Logging and Trace (DLT)
        1. 7.9.3.1 Introduction
          1. 7.9.3.1.1 Features
            1. 7.9.3.1.1.1 Block Diagram
      4. 7.9.4 Waveform Analyzer Diagnostics (WADI)
        1. 7.9.4.1 WADI Overview
          1. 7.9.4.1.1 Features
          2. 7.9.4.1.2 Block Diagram
          3. 7.9.4.1.3 Description
      5. 7.9.5 Embedded Real-Time Analysis and Diagnostic (ERAD)
      6. 7.9.6 Inter-Processor Communications (IPC)
        1. 7.9.6.1 Introduction
      7. 7.9.7 Watchdog
      8. 7.9.8 Dual-Clock Comparator (DCC)
        1. 7.9.8.1 Features
        2. 7.9.8.2 Mapping of DCCx Clock Source Inputs
      9. 7.9.9 Configurable Logic Block (CLB)
    10. 7.10 Lockstep Compare Module (LCM)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Reference Design
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Markings
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information
    2.     TRAY

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PZS|100
  • PTS|176
  • RFS|144
  • ZEX|256
サーマルパッド・メカニカル・データ
発注情報

6.15.1.2 Block Diagram

The following analog subsystem block diagrams show the connections between the different integrated analog modules to the device pins. These pins fall into two categories: analog module inputs/outputs and reference pins.

There are two reference pair pins, VREFHIAB /VREFLOAB and VREFHICDE/VREFLOCDE. VREFHIAB and VREFLOAB supply the reference for ADC A and ADC B modules which support both 16-bit and 12-bit mode. VREFHICDE and VREFLOCDE supply ADC C, ADC D and ADC E modules which only support 12-bit mode. VREFHIAB can also be used to supply DAC A, and VREFHICDE can also be used to supply DAC B

The VDAC reference pin can be used to set an alternate range for DAC A and DAC B, and for the DACs inside the CMPSS modules (the CMPSS DACs are referenced to VDDA and VSSA by default). Using this pin as a reference prevents the channel from being used as an ADC input (but the ADC can be used to sample the VDAC voltage, if desired). The choice of reference is configurable per module for each CMPSS or buffered DAC; the selection is made using the module's configuration registers.

Some analog pins support digital functionality through muxed AIOs and AGPIOs. AIOs only support digital input functionality, while AGPIOs support full digital input and output functionality.

The following notes apply to all packages:

  • Not all analog pins are available on all devices. See the device data sheet to determine which pins are available.
  • See the device data sheet to determine the allowable voltage range for VREFHI and VREFLO.
  • An external capacitor is required on the VREFHI pins. See the device data sheet for the specific value required.
  • For buffered DAC modules, VSSA is the low reference whether VREFHIx or VDAC is selected as the high reference.
  • For CMPSS modules, VSSA is the low reference whether VDAC or VDDA is selected as the high reference.

The following figures show how each analog group is structured. The Analog Pin Connections table lists the analog pins and internal connections.

F29H859TU-Q1 F29H850TU Analog Subsystem Block Diagram (ADC A and ADC B) Figure 6-31 Analog Subsystem Block Diagram (ADC A and ADC B)
F29H859TU-Q1 F29H850TU Analog Subsystem Block Diagram (ADC C, ADC D and ADC E) Figure 6-32 Analog Subsystem Block Diagram (ADC C, ADC D and ADC E)

Input connections to the CMPSS modules are selectable through a programmable input mux. Figure 6-33 shows the CMPSS input connections. Table 6-12 shows the mapping of ADC input signals to CMPSS mux inputs.

  • To configure the CMPH_POSIN input mux for CMPSSx, write to the CMPxHPMXSEL field in the CMPHPMXSEL or CMPHPMXSEL1 analog subsystem register.
  • To configure the CMPH_NEGIN input mux for CMPSSx, write to the CMPxHNMXSEL field in the CMPHNMXSEL analog subsystem register.
  • To configure the CMPL_POSIN input mux for CMPSSx, write to the CMPxLPMXSEL field in the CMPLPMXSEL or CMPLPMXSEL1 analog subsystem register.
  • To configure the CMPL_NEGIN input mux for CMPSSx, write to the CMPxLNMXSEL field in the CMPLNMXSEL analog subsystem register.

F29H859TU-Q1 F29H850TU Analog Group Connections Figure 6-33 Analog Group Connections
Table 6-12 CMPSS Input Mux Options
CMPSSx Input MUX CMP1 CMP2 CMP3 CMP4 CMP5 CMP6 CMP7 CMP8 CMP9 CMP10 CMP11 CMP12
HP0 A4 A6 B2 A0 D12 D8 D1 D3 C1 C0 C1 C8
HP1 A2 E8 B0 D5 E6 E17 B4 E4 C2 E10 E11 E1
HP2 A3 E9 B1 D0 E7 E16 B5 E5 A7 E12 E13 0.9*VREFHIAB
HP3 B3 D13 TempSense D2 TempSense 0.9*VREFHIAB 0.9*VREFHICDE A8 C9 D3 E1 0.9*VREFHICDE
HP4 D6 D7 E2 E3 A8 A9 A10 A11 B6 B7 B8 B9
HP5 A12 A13 A14 A15 C7 C8 C9 C10 B16 B17 C11 C12
HP6 B0 B2 D1 B8 C0 E0 A1 B9 A0 D0 A14 A15
HN0 A5 A7 B3 A1 D13 D9 D2 D4 A2 E8 B6 A6
HN1 A3 A4 B5 D5 E6 E17 B4 E4 E9 D12 C2 B1
LP0 A4 A6 B2 A0 D12 D8 D1 D3 C1 C0 C1 C8
LP1 A2 E8 B0 D5 E6 E17 B4 E4 C2 E10 E11 E1
LP2 A3 E9 B1 D0 E7 E16 B5 E5 A7 E12 E13 0.9*VREFHIAB
LP3 B3 D13 D9 D2 D4 0.9*VREFHIAB 0.9*VREFHICDE A8 C9 D3 E1 0.9*VREFHICDE
LP4 D6 D7 E2 E3 B10 B11 B12 B13 C3 C4 C5 C6
LP5 A12 A13 A14 A15 C13 C16 C17 D10 D11 D16 D17 E0
LP6 B0 B2 D1 B8 C0 E0 A1 B9 A0 D0 A14 A15
LN0 A5 A7 B3 A1 D13 D9 D2 D4 A2 E8 B6 A6
LN1 A3 A4 B5 D5 E6 E17 B4 E4 E9 D12 C2 B1