JAJSQA0D december   2011  – december 2020 HD3SS212

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Function
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Test Timing Diagrams
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 AC Coupling Caps
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11.   Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resource
    3. 11.3 Trademarks
  14. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.5 Electrical Characteristics

under recommended operating conditions
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DEVICE PARAMETERS
IIHInput high current (Dx_SEL)VDD = 3.6 V, VIN = VDD310µA
IILInput low current (Dx_SEL)VDD = 3.6 V, VIN = GND0.011µA
ILKLeakage current (Dx_SEL)VDD = 3.3 V, Vi = 2V, OE = 3.3V25µA
VDD = 0 V, Vi = 2 V, OE = 3.3 V610
Leakage current (HPDA)VDD = 3.3 V, Vi = 2 V, OE = 3.3 V; Dx_SEL=3.3 V0.012
Leakage current (HPDB)VDD = 3.3 V, Vi = 2 V, OE = 3.3 V; Dx_SEL=GND0.012
IoffDevice shut down currentVDD = 3.6 V, OE = GND5µA
IDDSupply currentVDD = 3.6 V, Dx_SELx = VCC/GND; Outputs floating2.55mA
DA, DB, DC HIGH SPEED SIGNAL PATH
CONOutputs ON capacitanceVi = 0 V, Outputs open, Switch ON1.5pF
COFFOutputs OFF capacitanceVi = 0 V, Outputs open, Switch OFF1pF
RONOutput ON resistanceVDD = 3.3 V, VCM = 0.5V - 1.5 V, IO = –40 mA6.510Ω
ΔRONOn resistance match between pairs of the same channelVDD = 3.3 V; -0.35V ≤ VI ≤ 1.2 V; IO = –40 mA1.5Ω
RFLAT_ONOn resistance flatness (RON (MAX) – RON (MAIN) )VDD = 3.3 V; -0.35 V ≤ VI ≤ 1.2 V1.3Ω
AUXx SIGNAL PATH
CONOutputs ON capacitanceVi = 0 V, Outputs open, Switch ON9pF
COFFOutputs OFF capacitanceVi = 0 V, Outputs open, Switch OFF3pF
RONOutput ON resistanceVDD = 3.3 V, VCM = 0.5 V - 1.5 V, IO = -40 mA712Ω
DEVICE PARAMETERS (under recommended operating conditions; RL, Rsc = 50 Ω unless otherwise noted
tPDSwitch propagation delayRsc and RL = 50 Ω, See Figure 7-2200ps
TonDx_SEL -to-Switch Ton (Data and AUX)Rsc and RL = 50 Ω, See Figure 7-1175250ns
ToffDx_SEL -to-Switch Toff (Data and AUX)175250
TonDx_SEL -to-Switch Ton (HPD)RL = 50 Ω, See Figure 7-1275350ns
ToffDx_SEL -to-Switch Toff (HPD)275350
TSK(O)Inter-pair output skew (CH-CH)Rsc and RL = 1 kΩ, See Figure 7-250ps
TSK(b-b)Intra-pair output skew (bit-bit)14
RLDx Differential return loss(1)1.35 GHz, See Section 6.6–17dB
2.7 GHz, See Section 6.6–11
XTALKDx Differential crosstalk(1)2.7 GHz–50
OIRRDx Differential off-isolation(1)2.7 GHz, See Section 6.6–22
ILDx Differential insertion loss(1)f = 1.35 GHz, See Section 6.6–0.7dB
f = 2.7 GHz, See Section 6.6–1.4
f = 5.4 GHz, See Section 6.6–1.7
AUX Differential insertion loss(1)f = 360 MHz–1dB
(1) For Return Loss, Crosstalk, Off-Isolation, and Insertion Loss values the data was collected on a Rogers material board with minimum length traces on the input and output of the device under test.