SLAS975A November   2013  – August 2015 HD3SS6126

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Device Parameters
    6. 6.6 Electrical Characteristics - Signal Switch Parameters
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Supply
        2. 8.2.2.2 Differential Pairs
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9 Power Supply Recommendations

The power supply must provide a constant voltage with a 10% maximum variation of the nominal value, and has to be able to provide at least 3 mA for the HD3SS6126 only (based on the maximum power consumption). It is also possible to provide the power supply from VBUS from the Host, just by including a voltage regulator powered through VBUS. Each VCC pin must have a 0.1-µF bypass capacitor placed as closely as possible. TI recommends including two extra capacitors in parallel, which should be also placed as closely as possible to the VCC pin. The suggested values for these extra capacitors are 1 µF and 0.01 µF.