This device is specified for current handling of up to 25A over
the entire –40°C to +125°C temperature range using a 2oz copper pour for the
input power plane, as well as no external airflow passing over the device.
The primary current-handling limitation for this device is how
much heat is dissipated inside the package. Efforts to improve heat transfer out
of the package and into the surrounding environment improve the ability of the
device to handle currents of up to 25A over a wider temperature range.
Heat transfer improvements primarily involve larger copper power
traces and planes with increased copper thickness (2oz.), as well as providing
airflow to pass over the device. Thermal vias help spread the current and power
dissipated over multiple board layers. The INA750x
evaluation module (EVM) features a 2oz copper pour for the planes, and is
capable of supporting 25A at temperatures up to 125°C.
The bypass capacitor must be placed close to device ground and
supply pins, but can be moved farther out if needed to avoid cutting thermal
planes. The recommended value of this bypass capacitor is 0.1µF. Additional
decoupling capacitance can be added to compensate for noisy or high-impedance
power supplies.