SBOSAE5 December   2024 INA750B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Shunt Resistor
      2. 6.3.2 Safe Operating Area
      3. 6.3.3 Short-Circuit Duration
      4. 6.3.4 Temperature Drift Correction
      5. 6.3.5 Enhanced PWM Rejection Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Adjusting the Output With the Reference Pin
        1. 6.4.1.1 Reference Pin Connections for Unidirectional Current Measurements
        2. 6.4.1.2 Ground Referenced Output
        3. 6.4.1.3 Reference Pin Connections for Bidirectional Current Measurements
        4. 6.4.1.4 Output Set to Mid-Supply Voltage
      2. 6.4.2 Adjustable Gain Set Using External Resistors
        1. 6.4.2.1 Adjustable Unity Gain
      3. 6.4.3 Thermal Alert Function
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Calculating Total Error
        1. 7.1.1.1 Error Sources
        2. 7.1.1.2 Reference Voltage Rejection Ratio Error
        3. 7.1.1.3 External Adjustable Gain Error
        4. 7.1.1.4 Total Error Example 1
        5. 7.1.1.5 Total Error Example 2
        6. 7.1.1.6 Total Error Example 3
        7. 7.1.1.7 Total Error Curves
    2. 7.2 Signal Filtering
    3. 7.3 Typical Application
      1. 7.3.1 High-Side, High-Drive, Solenoid Current-Sense Application
        1. 7.3.1.1 Design Requirements
        2. 7.3.1.2 Detailed Design Procedure
        3. 7.3.1.3 Application Curve
      2. 7.3.2 Speaker Enhancements and Diagnostics Using Current Sense Amplifier
        1. 7.3.2.1 Design Requirements
        2. 7.3.2.2 Detailed Design Procedure
        3. 7.3.2.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.3.2 Safe Operating Area

The heat dissipated across the package when current flows through the device ultimately determines the maximum current that can be safely handled by the package. The current consumption of the silicon is relatively low, leaving the total package resistance to carry the high load current as the primary contributor to the total power dissipation of the package. The maximum safe-operating current level shown in Figure 6-2 is set to make sure that the heat dissipated across the package is limited so that no damage occurs to the resistor or the package, or that the internal junction temperature of the silicon does not exceed a 165°C limit.

External factors, such as ambient temperature, external air flow, and PCB layout, contribute to how effectively the device dissipates heat. The internal heat is developed as a result of the current flowing through the total package resistance of 1mΩ.

INA750B Maximum Continuous Current vs Ambient Temperature Figure 6-2 Maximum Continuous Current vs Ambient Temperature