JAJSNA8 May   2024 INA790B

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Shunt Resistor
      2. 6.3.2 Safe Operating Area
      3. 6.3.3 Short-Circuit Duration
      4. 6.3.4 Temperature Stability
      5. 6.3.5 Enhanced PWM Rejection Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Adjusting the Output With the Reference Pin
        1. 6.4.1.1 Reference Pin Connections for Unidirectional Current Measurements
        2. 6.4.1.2 Ground Referenced Output
        3. 6.4.1.3 Reference Pin Connections for Bidirectional Current Measurements
        4. 6.4.1.4 Output Set to Mid-Supply Voltage
      2. 6.4.2 Adjustable Gain Set Using External Resistors
        1. 6.4.2.1 Adjustable Unity Gain
      3. 6.4.3 Thermal Alert Function
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Calculating Total Error
        1. 7.1.1.1 Error Sources
        2. 7.1.1.2 Reference Voltage Rejection Ratio Error
        3. 7.1.1.3 External Adjustable Gain Error
        4. 7.1.1.4 Total Error Example 1
        5. 7.1.1.5 Total Error Example 2
        6. 7.1.1.6 Total Error Example 3
    2. 7.2 Typical Applications
      1. 7.2.1 High-Side, High-Drive, Solenoid Current-Sense Application
        1. 7.2.1.1 Design Requirements
      2. 7.2.2 Speaker Enhancements and Diagnostics Using Current Sense Amplifier
        1. 7.2.2.1 Design Requirements
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) INA790x   UNIT
DEK (VQFN)
15 PINS
RθJA Junction-to-ambient thermal resistance 28.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 8.3 °C/W
RθJB Junction-to-board thermal resistance(2) 30.8 °C/W
ΨJT Junction-to-top characterization parameter(2) 1.1 °C/W
ΨJB Junction-to-board characterization parameter(2) 8.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Thermal metrics are relative to the internal die and are conservative relative to the heating that occur from the package leadframe shunt. For more details on heating, see the Safe Operating Area section.