JAJSOA9A March   2022  – October 2022 INA851

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adjustable Gain Setting
        1. 8.3.1.1 Gain Drift
      2. 8.3.2 Offset Voltage
      3. 8.3.3 Input Common-Mode Range
      4. 8.3.4 Input Protection
      5. 8.3.5 Output Clamping
      6. 8.3.6 Low Noise
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Common-Mode Pin
      2. 9.1.2 Output-Stage Gain Selection and Noise-Gain Shaping
      3. 9.1.3 Input Bias Current Return Path
      4. 9.1.4 Thermal Effects due to Power Dissipation
    2. 9.2 Typical Applications
      1. 9.2.1 Three-Pin Programmable Logic Controller (PLC)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 アプリケーション曲線
      2. 9.2.2 20-Bit, 1-MSPS ADS8900B Driver Circuit With FDA Noise Filter
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curves
      3. 9.2.3 24-Bit, 200 kSPS, Delta-Sigma ADS127L11 ADC Driver Circuit With FDA Noise Filter
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
        2. 10.1.1.2 TINA-TI™シミュレーション・ソフトウェア (無償ダウンロード)
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

Figure 6-1 RGT (16-Pin VQFN) Package, Top View
Table 6-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
FDA_IN– 15 Input Connection to output driver summing node.
FDA_IN+ 6 Input Connection to output driver summing node.
G02– 9 Input Connection to gain network. Short to OUT– for output stage gain GOUT of 0.2 V/V.
G02+ 12 Input Connection to gain network. Short to OUT+ for output stage gain GOUT of 0.2 V/V.
IN– 1 Input Negative (inverting) input.
IN+ 4 Input Positive (noninverting) input.
NC 8 — No connect
OUT– 10 Output Negative Output
OUT+ 11 Output Positive Output
RG 2,3 — Gain setting pin. Place a gain resistor between pin 2 and pin 3.
VCLAMP– 5 Input Level set for output clamp value. Connect either to an external supply that is at least 1.5 V above VS– or connect to VS– if clamping function is not required.
VCLAMP+ 16 Input Level set for output clamp value. Connect either to an external supply that is at least 1.5 V below VS+ or connect to VS+ if clamping function is not required.
VOCM 13 Input Level set for output common mode value.
VS– 7 Power Negative supply
VS+ 14 Power Positive supply
Thermal Pad Thermal pad — The thermal pad must be soldered to the printed-circuit board (PCB). Connect thermal pad to a plane or large copper pour electrically connected to the most negative supply or VS–.