JAJSDX8E June   2017  – August 2018 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション図
      2.      従来のソリューションと比較した、ISO121xデバイスによる基板の温度の低下
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—DC Specification
    10. 7.10 Switching Characteristics—AC Specification
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Sinking Inputs
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 10.2.1.2.2 Thermal Considerations
          3. 10.2.1.2.3 Designing for 48-V Systems
          4. 10.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 10.2.1.2.5 Surge, ESD, and EFT Tests
          6. 10.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 10.2.1.2.7 Status LEDs
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Sourcing Inputs
      3. 10.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 開発サポート
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 関連リンク
    4. 13.4 ドキュメントの更新通知を受け取る方法
    5. 13.5 コミュニティ・リソース
    6. 13.6 商標
    7. 13.7 静電気放電に関する注意事項
    8. 13.8 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBQ|16
サーマルパッド・メカニカル・データ
発注情報

7.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO1211
IS Safety input, output, or supply current - side 1 RθJA = 146.1°C/W, VI = 2.75 V, TJ = 150°C,
TA = 25°C, see Figure 1 		310 mA
RθJA = 146.1°C/W, VI = 3.6 V, TJ = 150°C,
TA = 25°C, see Figure 1 		237
RθJA = 146.1°C/W, VI = 5.5 V, TJ = 150°C,
TA = 25°C, see Figure 1 		155
IS Safety input current - field side RθJA = 146.1°C/W, VI = 24 V, TJ = 150°C,
TA = 25°C, see Figure 1 		35 mA
RθJA = 146.1°C/W, VI = 36 V, TJ = 150°C,
TA = 25°C, see Figure 1 		23
RθJA = 146.1°C/W, VI = 60 V, TJ = 150°C,
TA = 25°C, see Figure 1 		14
PS Safety input, output, or total power RθJA = 146.1°C/W, TJ = 150°C, TA = 25°C,
see Figure 2 		855 mW
TS Maximum safety temperature 150 °C
ISO1212
IS Safety input, output, or supply current - side 1 RθJA = 116.9°C/W, VI = 2.75 V, TJ = 150°C,
TA = 25°C, see Figure 3 		389 mA
RθJA= 116.9°C/W, VI = 3.6 V, TJ = 150°C,
TA = 25°C, see Figure 3 		297
RθJA = 116.9°C/W, VI = 5.5 V, TJ = 150°C,
TA = 25°C, see Figure 3 		194
IS Safety input current - field side RθJA = 116.9°C/W, VI = 24 V, TJ = 150°C,
TA = 25°C, see Figure 3 		44 mA
RθJA= 116.9°C/W, VI = 36 V, TJ = 150°C,
TA = 25°C, see Figure 3 		29
RθJA = 116.9°C/W, VI = 60 V, TJ = 150°C,
TA = 25°C, see Figure 3 		17
PS Safety input, output, or total power RθJA = 116.9°C/W, TJ = 150°C, TA = 25°C,
see Figure 4 		1070 mW
TS Maximum safety temperature 150 °C
(1) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.