JAJSDX8E June   2017  – August 2018 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション図
      2.      従来のソリューションと比較した、ISO121xデバイスによる基板の温度の低下
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—DC Specification
    10. 7.10 Switching Characteristics—AC Specification
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Sinking Inputs
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 10.2.1.2.2 Thermal Considerations
          3. 10.2.1.2.3 Designing for 48-V Systems
          4. 10.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 10.2.1.2.5 Surge, ESD, and EFT Tests
          6. 10.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 10.2.1.2.7 Status LEDs
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Sourcing Inputs
      3. 10.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 開発サポート
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 関連リンク
    4. 13.4 ドキュメントの更新通知を受け取る方法
    5. 13.5 コミュニティ・リソース
    6. 13.6 商標
    7. 13.7 静電気放電に関する注意事項
    8. 13.8 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBQ|16
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

ISO1211 D Package
8-Pin SOIC
Top View
ISO1211 ISO1212 pin_config_sllu258.gif

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 VCC1 — Power supply, side 1
2 EN I Output enable. The output pin on side 1 is enabled when the EN pin is high or open. The output pin on side 1 is in the high-impedance state when the EN pin is low. In noisy applications, tie the EN pin to VCC1.
3 OUT O Channel output
4 GND1 — Ground connection for VCC1
5 SUB — Internal connection to input chip substrate. Leave this pin unconnected on the board.
6 FGND — Field-side ground
7 IN I Field-side current input
8 SENSE I Field-side voltage sense
ISO1212 DBQ Package
16-Pin SSOP
Top View
ISO1211 ISO1212 iso1212-isolated-digital-input-receiver-pin-configuration.gif

Pin Functions

PIN I/O Description
NO. NAME
1 GND1 — Ground connection for VCC1
2 VCC1 — Power supply, side 1
3 EN I Output enable. The output pins on side 1 are enabled when the EN pin is high or open. The output pins on side 1 are in the high-impedance state when the EN pin is low. In noisy applications, tie the EN pin to VCC1.
4 OUT1 O Channel 1 output
5 OUT2 O Channel 2 output
6 NC — Not connected
7
8 GND1 — Ground connection for VCC1
9 FGND2 — Field-side ground, channel 2
10 IN2 I Field-side current input, channel 2
11 SENSE2 I Field-side voltage sense, channel 2
12 SUB2 — Internal connection to input chip 2 substrate. Leave this pin unconnected on the board.
13 SUB1 — Internal connection to input chip 1 substrate. Leave this pin unconnected on the board.
14 FGND1 — Field-side ground, channel 1
15 IN1 I Field-side current input, channel 1
16 SENSE1 I Field-side voltage sense, channel 1