JAJSJQ3E August   2021  – February 2023 ISO6760 , ISO6761 , ISO6762 , ISO6763

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Electrical Characteristics—1.8-V Supply
    16. 6.16 Supply Current Characteristics—1.8-V Supply
    17. 6.17 Switching Characteristics—5-V Supply
    18. 6.18 Switching Characteristics—3.3-V Supply
    19. 6.19 Switching Characteristics—2.5-V Supply
    20. 6.20 Switching Characteristics—1.8-V Supply
    21. 6.21 絶縁特性曲線
    22. 6.22 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC (1) ISO676x UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 68.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.8 °C/W
RθJB Junction-to-board thermal resistance 32.7 °C/W
ψJT Junction-to-top characterization parameter 13.5 °C/W
ψJB Junction-to-board characterization parameter 32.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W