JAJS350L September   2007  – October 2024 ISO7230C , ISO7231C , ISO7231M

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 3.3 V
    10. 6.10 Electrical Characteristics: VCC1 and VCC2 at 5-V
    11. 6.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V
    12. 6.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    13. 6.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V
    14. 6.14 Switching Characteristics: VCC1 and VCC2 at 5-V
    15. 6.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V
    16. 6.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
        1. 9.2.3.1 Insulation Characteristics Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

11 Revision History

Changes from Revision K (October 2015) to Revision L (October 2024)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • ドキュメント全体で VDE V 0884-11 を DIN VDE 0884-17 に更新Go
  • ドキュメント全体を通して容量性絶縁から絶縁バリアに参照を更新Go
  • Updated Thermal Characteristics, Safety Limiting Values, and Thermal Derating Curves to provide more accurate system-level thermal calculationsGo
  • Updated the Regulatory Information tableGo
  • Updated electrical and switching characteristics to match device performanceGo
  • Moved the Insulation Characteristics Curves to the Application Curves sectionGo

Changes from Revision J (May 2015) to Revision K (October 2015)

  • Added Note 1 to L(I01) and changed the MIN value From: 8.34 To 8 mm in the Insulation Specifications tableGo
  • Added Note 1 to LI02) and changed the MIN value From: 8.1 To 8 mm in the Insulation Specifications tableGo
  • Deleted Note 1 From the Safety-Related Certifications tableGo
  • Changed The ground symbols on the Enable circuit in the Device I/O Schematics imagesGo