6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
VCC |
Supply voltage(2) |
VCC1 , VCC2 |
–0.5 |
6 |
V |
|
Voltage(2) |
INx, OUTx |
–0.5 |
VCC+ 0.5(3) |
V |
IO |
Output current |
|
±15 |
mA |
TJ |
Junction temperature |
|
150 |
°C |
Tstg |
Storage temperature |
–65 |
150 |
°C |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal and are peak voltage values.
(3) Maximum voltage must not exceed 6 V.
6.2 ESD Ratings
|
VALUE |
UNIT |
V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per AEC Q100-002(1) |
±4000 |
V |
Charged-device model (CDM), per AEC Q100-011 |
±1500 |
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
|
MIN |
NOM |
MAX |
UNIT |
VCC1, VCC2 |
Supply voltage, |
3 |
|
5.5 |
V |
IOH |
High-level output current |
–4 |
|
|
mA |
IOL |
Low-level output current |
|
|
4 |
mA |
VIH |
High-level input voltage |
2 |
|
5.5 |
V |
VIL |
Low-level input voltage |
0 |
|
0.8 |
V |
tui |
Input pulse duration |
40 |
|
|
ns |
1 / tui |
Signaling rate |
0 |
|
25 |
Mbps |
TJ (1) |
Junction temperature |
|
|
136 |
°C |
TA |
Ambient temperature |
-40 |
25 |
125 |
°C |
(1) To maintain the recommended operating conditions for T
J, see the
Thermal Information table.
6.4 Thermal Information
THERMAL METRIC(1) |
ISO732x-Q1 |
UNIT |
D (SOIC) |
8 PINS |
RθJA |
Junction-to-ambient thermal resistance |
121 |
°C/W |
RθJCtop |
Junction-to-case (top) thermal resistance |
67.9 |
°C/W |
RθJB |
Junction-to-board thermal resistance |
61.6 |
°C/W |
ψJT |
Junction-to-top characterization parameter |
21.5 |
°C/W |
ψJB |
Junction-to-board characterization parameter |
61.1 |
°C/W |
RθJCbot |
Junction-to-case (bottom) thermal resistance |
N/A |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
6.5 Electrical Characteristics—5-V Supply
VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
VOH |
High-level output voltage |
IOH = –4 mA; see Figure 11 |
VCCO(1)– 0.5 |
4.7 |
|
V |
IOH = –20 μA; see Figure 11 |
VCCO(1) – 0.1 |
5 |
|
VOL |
Low-level output voltage |
IOL = 4 mA; see Figure 11 |
|
0.2 |
0.4 |
V |
IOL = 20 μA; see Figure 11 |
|
0 |
0.1 |
VI(HYS) |
Input threshold voltage hysteresis |
|
|
460 |
|
mV |
IIH |
High-level input current |
IN = VCC |
|
|
10 |
μA |
IIL |
Low-level input current |
IN = 0 V |
–10 |
|
|
μA |
CMTI |
Common-mode transient immunity |
VI = VCC or 0 V; see Figure 13. |
25 |
65 |
|
kV/μs |
(1) VCCO is supply voltage, VCC1 or VCC2, for the output channel being measured.
6.6 Supply Current Characteristics—5-V Supply
All inputs switching with square wave clock signal for dynamic ICC measurement. VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
SUPPLY CURRENT |
MIN |
TYP |
MAX |
UNIT |
ISO7320-Q1 |
|
Supply current for VCC1 and VCC2 |
DC to 1 Mbps |
DC Input: VI = VCC or 0 V, AC Input: CL = 15 pF |
ICC1 |
|
0.4 |
0.9 |
mA |
ICC2 |
|
2 |
3.2 |
10 Mbps |
CL = 15 pF |
ICC1 |
|
0.8 |
1.4 |
ICC2 |
|
3.2 |
4.4 |
25 Mbps |
CL = 15 pF |
ICC1 |
|
1.4 |
2.3 |
ICC2 |
|
4.9 |
6.8 |
ISO7321-Q1 |
|
Supply current for VCC1 and VCC2 |
DC to 1 Mbps |
DC Input: VI = VCC or 0 V, AC Input: CL = 15 pF |
ICC1 , ICC2 |
|
1.7 |
2.8 |
mA |
10 Mbps |
CL = 15 pF |
ICC1 , ICC2 |
|
2.5 |
3.7 |
25 Mbps |
CL = 15 pF |
ICC1 , ICC2 |
|
3.7 |
5.4 |
6.7 Electrical Characteristics—3.3 V
VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
VOH |
High-level output voltage |
IOH = –4 mA; see Figure 11 |
VCCO(1)– 0.5 |
3 |
|
V |
IOH = –20 μA; see Figure 11 |
VCCO(1)– 0.1 |
3.3 |
|
VOL |
Low-level output voltage |
IOL = 4 mA; see Figure 11 |
|
0.2 |
0.4 |
V |
IOL = 20 μA; see Figure 11 |
|
0 |
0.1 |
VI(HYS) |
Input threshold voltage hysteresis |
|
|
450 |
|
mV |
IIH |
High-level input current |
IN = VCC |
|
|
10 |
μA |
IIL |
Low-level input current |
IN = 0 V |
–10 |
|
|
μA |
CMTI |
Common-mode transient immunity |
VI = VCC or 0 V; see Figure 13 |
25 |
50 |
|
kV/μs |
(1) VCCO is supply voltage, VCC1 or VCC2, for the output channel being measured.
6.8 Supply Current Characteristics—3.3-V Supply
All inputs switching with square wave clock signal for dynamic ICC measurement. VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
SUPPLY CURRENT |
MIN |
TYP |
MAX |
UNIT |
ISO7320-Q1 |
|
Supply current for VCC1 and VCC2 |
DC to 1 Mbps |
DC Input: VI = VCC or 0 V, AC Input: CL = 15 pF |
ICC1 |
|
0.2 |
0.5 |
mA |
ICC2 |
|
1.5 |
2.5 |
10 Mbps |
CL = 15 pF |
ICC1 |
|
0.5 |
0.8 |
ICC2 |
|
2.2 |
3.2 |
25 Mbps |
CL = 15 pF |
ICC1 |
|
0.9 |
1.4 |
ICC2 |
|
3.3 |
4.7 |
ISO7321-Q1 |
|
Supply current for VCC1 and VCC2 |
DC to 1 Mbps |
DC Input: VI = VCC or 0 V, AC Input: CL = 15 pF |
ICC1 , ICC2 |
|
1.2 |
2 |
mA |
10 Mbps |
CL = 15 pF |
ICC1 , ICC2 |
|
1.7 |
2.5 |
25 Mbps |
CL = 15 pF |
ICC1 , ICC2 |
|
2.5 |
3.6 |
6.9 Power Dissipation Characteristics
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, input a 12.5 MHz 50% duty-cycle square wave (unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
PD |
Maximum power dissipation by ISO7320-Q1 |
|
|
|
56 |
mW |
PD1 |
Maximum power dissipation by side-1 of ISO7320-Q1 |
|
|
|
15 |
mW |
PD2 |
Maximum power dissipation by side-2 of ISO7320-Q1 |
|
|
|
41 |
mW |
PD |
Maximum power dissipation by ISO7321-Q1 |
|
|
|
67 |
mW |
PD1 |
Maximum power dissipation by side-1 of ISO7321-Q1 |
|
|
|
33.5 |
mW |
PD2 |
Maximum power dissipation by side-2 of ISO7321-Q1 |
|
|
|
33.5 |
mW |
6.10 Switching Characteristics—5-V Supply
VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
tPLH, tPHL |
Propagation delay time |
See Figure 11 |
20 |
33 |
57 |
ns |
PWD(1) |
Pulse width distortion |tPHL – tPLH| |
See Figure 11 |
|
|
4 |
ns |
tsk(o)(2) |
Channel-to-channel output skew time |
ISO7320-Q1 |
|
|
|
2 |
ns |
ISO7321-Q1 |
|
|
|
17 |
tsk(pp) (3) |
Part-to-part skew time |
|
|
|
23 |
ns |
tr |
Output signal rise time |
See Figure 11 |
|
2.4 |
|
ns |
tf |
Output signal fall time |
See Figure 11 |
|
2.1 |
|
ns |
tfs |
Fail-safe output delay time from input power loss |
See Figure 12 |
|
7.5 |
|
μs |
(1) Also known as pulse skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
6.11 Switching Characteristics—3.3-V Supply
VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
tPLH, tPHL |
Propagation delay time |
See Figure 11 |
22 |
37 |
66 |
ns |
PWD(1) |
Pulse width distortion |tPHL – tPLH| |
See Figure 11 |
|
|
3 |
ns |
tsk(o)(2) |
Channel-to-channel output skew time |
ISO7320-Q1 |
|
|
|
3 |
ns |
ISO7321-Q1 |
|
|
|
16 |
tsk(pp) (3) |
Part-to-part skew time |
|
|
|
28 |
ns |
tr |
Output signal rise time |
See Figure 11 |
|
3.1 |
|
ns |
tf |
Output signal fall time |
See Figure 11 |
|
2.6 |
|
|
ns |
tfs |
Fail-safe output delay time from input power loss |
See Figure 12 |
|
7.4 |
|
μs |
(1) Also known as pulse skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
6.12 Typical Characteristics
Figure 1. ISO7320-Q1 Supply Current vs Data Rate
Figure 3. ISO7321-Q1 Supply Current vs Data Rate
Figure 5. High-Level Output Voltage vs High-Level Output Current
Figure 7. Power Supply Under Voltage Threshold vs Free-Air Temperature
Figure 9. Input Glitch Suppression Time vs Free-Air Temperature
Figure 2. ISO7320-Q1 Supply Current vs Data Rate
Figure 4. ISO7321-Q1 Supply Current vs Data Rate
Figure 6. Low-Level Output Voltage vs Low-Level Output Current
Figure 8. Propagation Delay Time vs Free-Air Temperature
Figure 10. Peak-to-Peak Output Jitter vs Data Rate