SLLSEI6G September   2014  – January 2017 ISO7340C , ISO7340FC , ISO7341C , ISO7341FC , ISO7342C , ISO7342FC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Switching Characteristics—5-V Supply
    14. 7.14 Switching Characteristics—3.3-V Supply
    15. 7.15 Insulation Characteristics Curves
    16. 7.16 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Isolated Data Acquisition System for Process Control
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Typical Supply Current Equations
            1. 10.2.1.2.1.1 ISO7340x
            2. 10.2.1.2.1.2 ISO7341x
            3. 10.2.1.2.1.3 ISO7342x
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Application for Module With 16 Inputs
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Typical Application for RS-232 Interface
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resource
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

DW Package
16-Pin SOIC
ISO7340x Top View
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC po_7340C_sllsei6.gif
DW Package
16-Pin SOIC
ISO7341x Top View
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC po_7341C_sllsei6.gif
DW Package
16-Pin SOIC
ISO7342x Top View
ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC po_7342C_sllsei6.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ISO7340x ISO7341x ISO7342x
EN 10 — — I Output enable. All output pins are enabled when EN is high or disconnected and disabled when EN is low.
EN1 — 7 7 I Output enable 1. Output pins on side-1 are enabled when EN1 is high or disconnected and disabled when EN1 is low.
EN2 — 10 10 I Output enable 2. Output pins on side-2 are enabled when EN2 is high or disconnected and disabled when EN2 is low.
GND1 2 2 2 — Ground connection for VCC1
8 8 8
GND2 9 9 9 — Ground connection for VCC2
15 15 15
INA 3 3 3 I Input, channel A
INB 4 4 4 I Input, channel B
INC 5 5 12 I Input, channel C
IND 6 11 11 I Input, channel D
NC 7 — — — No connect pins are floating with no internal connection
OUTA 14 14 14 O Output, channel A
OUTB 13 13 13 O Output, channel B
OUTC 12 12 5 O Output, channel C
OUTD 11 6 6 O Output, channel D
VCC1 1 1 1 — Power supply, VCC1
VCC2 16 16 16 — Power supply, VCC2