JAJSU29 March   2024 ISOUSB211-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply Options
      2. 7.3.2  Power Up
      3. 7.3.3  Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 7.3.4  Connect and Speed Detection
      5. 7.3.5  Disconnect Detection
      6. 7.3.6  Reset
      7. 7.3.7  LS/FS Message Traffic
      8. 7.3.8  HS Message Traffic
      9. 7.3.9  Equalization and Pre-emphasis
      10. 7.3.10 L2 Power Management State (Suspend) and Resume
      11. 7.3.11 L1 Power Management State (Sleep) and Resume
      12. 7.3.12 HS Test Mode Support
      13. 7.3.13 CDP Advertising
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Isolated Host or Hub
      2. 8.1.2 Isolated Peripheral - Self-Powered
      3. 8.1.3 Isolated Peripheral - Bus-Powered
      4. 8.1.4 Application Curve
        1. 8.1.4.1 Insulation Lifetime
    2. 8.2 Meeting USB2.0 HS Eye-Diagram Specifications
    3. 8.3 Thermal Considerations
      1. 8.3.1 VBUS / V3P3V Power
      2. 8.3.2 VCCx / V1P8Vx Power
      3. 8.3.3 Example Configuration 1
      4. 8.3.4 Example Configuration 2
      5. 8.3.5 Example Configuration 3
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Layout Example
        2. 8.5.1.2 PCB Material
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DP|28
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) ISOUSB211 UNIT
DP (SSOP)
28 PINS
RΘJA Junction-to-ambient thermal resistance 44.2 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 13.9 °C/W
RΘJB Junction-to-board thermal resistance 19.0 °C/W
ψJT Junction-to-top characterization parameter 3.3 °C/W
ψJB Junction-to-board characterization parameter 18.4 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.