JAJSE60B November   2017  – September 2019 ISOW7821

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     概略回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Input, 5-V Output
    10. 7.10 Supply Current Characteristics—5-V Input, 5-V Output
    11. 7.11 Electrical Characteristics—5-V Input, 3.3-V Output
    12. 7.12 Supply Current Characteristics—5-V Input, 3.3-V Output
    13. 7.13 Electrical Characteristics—3.3-V Input, 3.3-V Output
    14. 7.14 Supply Current Characteristics—3.3-V Input, 3.3-V Output
    15. 7.15 Switching Characteristics—5-V Input, 5-V Output
    16. 7.16 Switching Characteristics—5-V Input, 3.3-V Output
    17. 7.17 Switching Characteristics—3.3-V Input, 3.3-V Output
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Current Limit, Thermal Overload Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 開発サポート
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 コミュニティ・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 改訂履歴

Changes from A Revision (March 2018) to B Revision

  • ドキュメント全体を通して編集および装飾的な変更Go
  • 「特長」に「堅牢な絶縁バリア」の箇条書き項目を追加Go
  • 「1kVRMS の動作電圧で推定寿命 100 年以上」の箇条書き項目を「特長」に追加Go
  • 「最高 5000VRMS の絶縁定格」の箇条書き項目を「特長」に追加Go
  • 「最高 10kVPK のサージ能力」の箇条書き項目を「特長」に追加Go
  • 「絶縁バリアを挟んだ接触放電に対する保護：±8kV IEC 61000-4-2」箇条書き項目を「特長」に追加Go
  • 「特長」および「Insulation Specifications」表で、VDE 標準名を「DIN V VDE V 0884-11:2017-01」から「DIN VDE V 0884-11:2017-01」に変更Go
  • 「特長」の TUV 認定についての箇条書き項目に、「EN 62368-1」標準を追加Go
  • 「特長」の「すべての代理認定は計画中」箇条書き項目を削除Go
  • 「概略回路図」を更新し、1 つの絶縁チャネルにつき 1 つのコンデンサではなく、2 つの絶縁コンデンサを直列に記載Go
  • Added "Contact discharge per IEC 61000-4-2; Isolation barrier withstand test" specification of ±8000 in ESD Ratings tableGo
  • Added table note "IEC ESD strike is applied across the barrier with all pins on each side tied together creating a two-terminal device" to ESD Ratings tableGo
  • Deleted "TJ or Junction temperature" parameter from Recommended Operating Conditions table as it is already specified in Absolute Maximum Ratings tableGo
  • Added "See Figure 34" to TEST CONDITIONS of VIOWM specificationGo
  • Updated Safety-Related Certifications table Go
  • Added the following note to Figure 25: "Optional 100 µF capacitor can be added between VCC and GND1; refer to Power Supply Recommendations" Go
  • Added the following note to Figure 30: "Optional 100 µF capacitor can be added between VCC and GND1; refer to Power Supply Recommendations" Go
  • Added the following text to Design Requirements: "Optional 100 µF decoupling capacitor can be added between VCC and GND1 pins; refer to Power Supply Recommendations for more details"Go
  • Added text to Power Supply Recommendations section to emphasise that input decoupling capacitor should be larger than output capacitor by at least 100 µF Go
  • Added the following note to Figure 35: "Optional 100 µF capacitor can be added between VCC and GND1; refer to Power Supply Recommendations" Go

Changes from * Revision (November 2017) to A Revision

  • Changed OUTB to pin 4 and INB to pin 13 in the Pin Functions tableGo