JAJSIK2B february   2020  – december 2020 ISOW7841A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Description Continued
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Input, 5-V Output
    10. 7.10 Supply Current Characteristics—5-V Input, 5-V Output
    11. 7.11 Electrical Characteristics—3.3-V Input, 5-V Output
    12. 7.12 Supply Current Characteristics—3.3-V Input, 5-V Output
    13. 7.13 Electrical Characteristics—5-V Input, 3.3-V Output
    14. 7.14 Supply Current Characteristics—5-V Input, 3.3-V Output
    15. 7.15 Electrical Characteristics—3.3-V Input, 3.3-V Output
    16. 7.16 Supply Current Characteristics—3.3-V Input, 3.3-V Output
    17. 7.17 Switching Characteristics—5-V Input, 5-V Output
    18. 7.18 Switching Characteristics—3.3-V Input, 5-V Output
    19. 7.19 Switching Characteristics—5-V Input, 3.3-V Output
    20. 7.20 Switching Characteristics—3.3-V Input, 3.3-V Output
    21. 7.21 Insulation Characteristics Curves
    22. 7.22 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Current Limit, Thermal Overload Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  12.   Power Supply Recommendations
  13. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  14. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Glossary
  15. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC 1 ISOW7841A-Q1 UNIT
DWE (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 56.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.6 °C/W
RθJB Junction-to-board thermal resistance 28.5 °C/W
ΨJT Junction-to-top characterization parameter 2.4 °C/W
ΨJB Junction-to-board characterization parameter 28.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.