JAJSIK2B february   2020  – december 2020 ISOW7841A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Description Continued
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Input, 5-V Output
    10. 7.10 Supply Current Characteristics—5-V Input, 5-V Output
    11. 7.11 Electrical Characteristics—3.3-V Input, 5-V Output
    12. 7.12 Supply Current Characteristics—3.3-V Input, 5-V Output
    13. 7.13 Electrical Characteristics—5-V Input, 3.3-V Output
    14. 7.14 Supply Current Characteristics—5-V Input, 3.3-V Output
    15. 7.15 Electrical Characteristics—3.3-V Input, 3.3-V Output
    16. 7.16 Supply Current Characteristics—3.3-V Input, 3.3-V Output
    17. 7.17 Switching Characteristics—5-V Input, 5-V Output
    18. 7.18 Switching Characteristics—3.3-V Input, 5-V Output
    19. 7.19 Switching Characteristics—5-V Input, 3.3-V Output
    20. 7.20 Switching Characteristics—3.3-V Input, 3.3-V Output
    21. 7.21 Insulation Characteristics Curves
    22. 7.22 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Current Limit, Thermal Overload Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  12.   Power Supply Recommendations
  13. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  14. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Glossary
  15. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.