Packaging Information
Orderable Device |
Status(1) |
Package Type |
Package Drawing |
Pins |
Package Qty |
Eco Plan(2) |
Lead/Ball Finish(6) |
MSL Peak Temp(3) |
Op Temp (°C) |
Device Marking(4)(5) |
IWR6243ABGABL |
ACTIVE |
FCCSP |
ABL |
161 |
176 |
RoHS & Green |
Call TI |
Level-3-260C-168 HR |
-40 to 105 |
IWR6243 BG 592A ABL G1 |
IWR6243ABGABLR |
ACTIVE |
FCCSP |
ABL |
161 |
1000 |
RoHS & Green |
Call TI |
Level-3-260C-168 HR |
-40 to 105 |
IWR6243 BG 592A ABL G1 |
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a
lifetime-buy period is in effect.
NRND: Not recommended for new
designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PRE_PROD Unannounced device, not in production, not
available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free
(RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
www.ti.com/productcontent for
the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible
with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1%
by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products
are suitable for use in specified lead-free processes.
Pb-Free (RoHS
Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used
between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component
is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green
(RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br)
and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous
material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating
according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo,
the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one
Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is
indented then it is a continuation of the previous line and the two combined represent the entire Device
Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple
material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may
wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer: The
information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes
no representation or warranty as to the accuracy of such information. Efforts are underway to
better integrate information from third parties. TI has taken and continues to take reasonable
steps to provide representative and accurate information but may not have conducted destructive
testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider
certain information to be proprietary, and thus CAS numbers and other limited information may
not be available for release. |
In no event shall TI's liability arising out of such
information exceed the total purchase price of the TI part(s) at issue in this document sold by
TI to Customer on an annual basis. |