JAJSI72 November   2019 LDC1001

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     軸方向距離検出アプリケーション
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Condition
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductive Sensing
      2. 7.3.2 Measuring RP With LDC1001
      3. 7.3.3 Measuring Inductance With LDC1001
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 INTB Pin Modes
        1. 7.4.2.1 Comparator Mode
        2. 7.4.2.2 Wake-Up Mode
        3. 7.4.2.3 DRDY Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Description
        1. 7.5.1.1 Extended SPI Transactions
    6. 7.6 Register Maps
      1. 7.6.1 Register Description
        1. 7.6.1.1  Revision ID (Address = 0x00)
        2. 7.6.1.2  RP_MAX (Address = 0x01)
        3. 7.6.1.3  RP_MIN (Address = 0x02)
        4. 7.6.1.4  Watchdog Timer Frequency (Address = 0x03)
        5. 7.6.1.5  LDC Configuration (Address = 0x04)
        6. 7.6.1.6  Clock Configuration (Address = 0x05)
        7. 7.6.1.7  Comparator Threshold High LSB (Address = 0x06)
        8. 7.6.1.8  Comparator Threshold High MSB (Address = 0x07)
        9. 7.6.1.9  Comparator Threshold Low LSB (Address = 0x08)
        10. 7.6.1.10 Comparator Threshold Low MSB (Address = 0x09)
        11. 7.6.1.11 INTB Pin Configuration (Address = 0x0A)
        12. 7.6.1.12 Power Configuration (Address = 0x0B)
        13. 7.6.1.13 Status (Address = 0x20)
        14. 7.6.1.14 Proximity Data LSB (Address = 0x21)
        15. 7.6.1.15 Proximity Data MSB (Address = 0x22)
        16. 7.6.1.16 Frequency Counter LSB (Address = 0x23)
        17. 7.6.1.17 Frequency Counter Mid-Byte (Address = 0x24)
        18. 7.6.1.18 Frequency Counter MSB (Address = 0x25)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calculation of RP_MIN and RP_MAX
        1. 8.1.1.1 RP_MAX
        2. 8.1.1.2 RP_MIN
      2. 8.1.2 Output Data Rate
      3. 8.1.3 Choosing Filter Capacitor (CFA and CFB Pins)
    2. 8.2 Typical Application
      1. 8.2.1 Axial Distance Sensing Using a PCB Sensor With LDC1001
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sensor and Target
          2. 8.2.1.2.2 Calculating Sensor Capacitor
          3. 8.2.1.2.3 Choosing Filter Capacitor
          4. 8.2.1.2.4 Setting RP_MIN and RP_MAX
          5. 8.2.1.2.5 Calculating Minimum Sensor Frequency
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 サポート・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) LDC1001 UNIT
NHR (WSON)
16 PINS
RθJA Junction-to-ambient thermal resistance(2) 28 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB. The package thermal impedance is calculated in accordance with JESD 51-7.