LM25101 3-A, 2-A, and 1-A 80-V Half-Bridge Gate Drivers
1 Features
- Independent High and Low Driver Logic Inputs
- Bootstrap Supply Voltage up to 100-V DC
- Drives Both a High-Side and Low-Side N-Channel MOSFETs
- Fast Propagation Times (25 ns Typical)
- Drives 1000-pF Load With 8-ns Rise and Fall Times
- Excellent Propagation Delay Matching (3 ns Typical)
- Supply Rail Undervoltage Lockout
- Low Power Consumption
- Pin Compatible With HIP2100 and HIP2101
2 Applications
- Motor-Controlled Drivers
- Half and Full Bridge Power Converters
- Synchronous Buck Converters
- Two Switch Forward Power Converters
- Forward With Active Clamp Converters
- 48-V Server Power
- Solar DC-DC and DC-AC Converters
3 Description
The LM25101 high-voltage gate driver is designed to drive both the high-side and the low-side N-Channel MOSFETs in a synchronous buck or a half-bridge configuration. The A version provides a full 3-A of gate drive while the B and C versions provide 2-A and 1-A, respectively. The outputs are independently controlled with TTL input thresholds. An integrated high voltage diode is provided to charge the high-side gate drive bootstrap capacitor. A robust level shifter operates at high speed while consuming low power and providing clean level transitions from the control logic to the high-side gate driver. Undervoltage lockout is provided on both the low-side and the high-side power rails.
These devices are available in the standard 8-pin SOIC, 8-pin SO-PowerPAD, 8-pin WSON, 10-pin WSON, and 8-pin MSOP PowerPAD packages.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| LM25101 | MSOP PowerPAD (8) | 3 mm × 3 mm |
| WSON (8) | 4 mm × 4 mm | |
| WSON (10) | 4 mm × 4 mm | |
| SO PowerPAD (8) | 3.9 mm × 4.89 mm | |
| SOIC (8) | 3.91 mm × 4.9 mm |
- For all available packages, see the orderable addendum at the end of the data sheet.
Simplified Application Diagram
4 Revision History
Changes from B Revision (March 2013) to C Revision
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
- Added Thermal Information tableGo
Changes from * Revision (March 2013) to A Revision
- Changed layout of National Semiconductor Data Sheet to TI formatGo
5 Device Options
Table 1. Input/Output Options
| Part Number | Input Thresholds | Peak Output Current |
|---|---|---|
| LM25101A | TTL | 3 A |
| LM25101B | TTL | 2 A |
| LM25101C | TTL | 1 A |
6 Pin Configuration and Functions
Pin Functions
| PIN | TYPE | DESCRIPTION | |||||
|---|---|---|---|---|---|---|---|
| NAME | MSOP PowerPAD | WSON (8) | WSON (10) | SO PowerPAD | SOIC | ||
| HB | 2 | 2 | 2 | 2 | 2 | PWR | High-side gate driver bootstrap rail. Connect the positive terminal of the bootstrap capacitor to HB and the negative terminal to HS. The bootstrap capacitor should be placed as close to the IC as possible. |
| HI | 5 | 5 | 7 | 5 | 5 | I | High-side driver control input. The LM25101 inputs have TTL type thresholds. Unused inputs should be tied to ground and not left open. |
| HO | 3 | 3 | 3 | 3 | 3 | O | High-side gate driver output. Connect to the gate of high-side MOSFET with a short, low inductance path. |
| HS | 4 | 4 | 4 | 4 | 4 | GND | High-side MOSFET source connection. Connect to the bootstrap capacitor negative terminal and the source of the high-side MOSFET. |
| LI | 6 | 6 | 8 | 6 | 6 | I | Low-side driver control input. The LM25101 inputs have TTL type thresholds. Unused inputs should be tied to ground and not left open. |
| LO | 8 | 8 | 10 | 8 | 8 | O | Low-side gate driver output. Connect to the gate of the low-side MOSFET with a short, low inductance path. |
| NC | — | — | 5, 6 | — | — | — | No connection |
| VDD | 1 | 1 | 1 | 1 | 1 | PWR | Positive gate drive supply. Locally decouple to VSS using a low ESR and ESL capacitor located as close to the IC as possible. |
| VSS | 7 | 7 | 9 | 7 | 7 | GND | Ground return. All signals are referenced to this ground. |
| Thermal Pad | PowerPAD | Thermal Pad | Thermal Pad | PowerPAD | — | — | Solder to the ground plane under the IC to aid in heat dissipation.(1) |
