JAJS852E May   1996  – May 2019 LM2586

PRODUCTION DATA.  

  1. 1 特長
  2. 2 代表的なアプリケーション
  3. 3 概要
    1.     Device Images
      1.      ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configurations
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Ratings
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: 3.3 V
    6. 7.6 Electrical Characteristics: 5 V
    7. 7.7 Electrical Characteristics: 12 V
    8. 7.8 Electrical Characteristics: Adjustable
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flyback Regulator Operation
      2. 8.3.2 Step-Up (Boost) Regulator Operation
      3. 8.3.3 Programming Output Voltage (Selecting R1 And R2)
      4. 8.3.4 Shutdown Control
      5. 8.3.5 Frequency Adjustment
      6. 8.3.6 Frequency Synchronization
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Flyback Regulator Applications
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Transformer Selection (T)
          2. 9.2.1.1.2 Transformer Footprints
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Flyback Regulator Input Capacitors
          3. 9.2.1.2.3 Switch Voltage Limits
          4. 9.2.1.2.4 Output Voltage Limitations
          5. 9.2.1.2.5 Noisy Input Line Condition
          6. 9.2.1.2.6 Stability
      2. 9.2.2 Typical Boost Regulator Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 System Examples
      1. 9.3.1 Test Circuits
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Heat Sink/Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 12.1.2 開発サポート
        1. 12.1.2.1 WEBENCH®ツールによるカスタム設計
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) LM2585 UNIT
KTW (DDPAK/TO-263 NDZ (TO-220)
7 PINS 7 PINS
RθJA Junction-to-ambient thermal resistance 56(2) 65(3) °C/W
35(4) 45(5)
26(6) —
RθJC Junction-to-case thermal resistance 2 2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
(2) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(3) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area.
(4) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(5) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(6) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK/TO-2633 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal resistance further.