JAJS827E April   2000  – June 2019 LM2587

PRODUCTION DATA.  

  1. 特長
  2. 代表的なアプリケーション
  3. 概要
    1.     Device Images
      1.      フライバック・レギュレータ
  4. 改訂履歴
  5. Pin Configurations
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESDRatings
    3. 6.3  Recommended Operating Ratings
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 3.3 V
    6. 6.6  Electrical Characteristics: 5 V
    7. 6.7  Electrical Characteristics: 12 V
    8. 6.8  Electrical Characteristics: Adjustable
    9. 6.9  Electrical Characteristics: All Output Voltage Versions
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Step-Up (Boost) Regulator Operation
  8. Application And Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Boost Regulator Applications
      2. 8.2.2 Typical Flyback Regulator Applications
        1. 8.2.2.1 Transformer Selection (T)
        2. 8.2.2.2 Transformer Footprints
          1. 8.2.2.2.0.1 T4
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
        1. 8.2.4.1 Custom Design With Webench® Tools
        2. 8.2.4.2 Programming Output Voltage (Selecting R1 And R2)
        3. 8.2.4.3 Short Circuit Condition
        4. 8.2.4.4 Flyback Regulator Input Capacitors
        5. 8.2.4.5 Switch Voltage Limits
        6. 8.2.4.6 Output Voltage Limitations
        7. 8.2.4.7 Noisy Input Line Condition)
        8. 8.2.4.8 Stability
    3. 8.3 Additional Application Examples
      1. 8.3.1 Test Circuits
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Heat Sink/Thermal Considerations
      1. 9.3.1 European Magnetic Vendor Contacts
      2. 9.3.2 Coilcraft
      3. 9.3.3 Pulse Engineering
  10. 10デバイスおよびドキュメントのサポート
    1. 10.1 デバイス・サポート
      1. 10.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 10.1.2 開発サポート
        1. 10.1.2.1 Webench® ツールによるカスタム設計
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 コミュニティ・リソース
    4. 10.4 商標
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 Glossary
  11. 11メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1)(2) LM2585 UNIT
KTT (DDPAK/TO-263 NDH (TO-220)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 56(5) 65(3) °C/W
35(6) 45(4)
26(7)
RθJC Junction-to-case thermal resistance 2 2 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the LM2587 is used as shown in Figure 61 and Figure 62, system performance will be as specified by the system parameters.
Junction-to-ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area.
Junction-to-ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1oz.) copper area surrounding the leads.
Junction-to-ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Junction-to-ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Junction-to-ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal resistance further. See the thermal model in Switchers Made Simple® software.