JAJSFG6A May   2018  – July 2019 LM26420-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      LM26420デュアル降圧DC/DCコンバータ
      2.      LM26420の効率(最高93%)
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: 16-Pin WQFN
    2.     Pin Functions 20-Pin HTSSOP
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics Per Buck
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Power Good
      3. 7.3.3 Precision Enable
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Overvoltage Protection
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Current Limit
      4. 7.4.4 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Programming Output Voltage
      2. 8.1.2 VINC Filtering Components
      3. 8.1.3 Using Precision Enable and Power Good
      4. 8.1.4 Overcurrent Protection
    2. 8.2 Typical Applications
      1. 8.2.1 2.2-MHz, 0.8-V Typical High-Efficiency Application Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input Capacitor Selection
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Calculating Efficiency and Junction Temperature
        3. 8.2.1.3 Application Curves
      2. 8.2.2 2.2-MHz, 1.8-V Typical High-Efficiency Application Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 LM26420-Q12.2-MHz, 2.5-V Typical High-Efficiency Application Circuit
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Method 1: Silicon Junction Temperature Determination
      2. 10.3.2 Thermal Shutdown Temperature Determination
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 WEBENCH®ツールによるカスタム設計
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.3.2 Thermal Shutdown Temperature Determination

The second method, although more complicated, can give a very accurate silicon junction temperature.

The first step is to determine RθJA of the application. The LM26420-Q1 has over-temperature protection circuitry. When the silicon temperature reaches 165°C, the device stops switching. The protection circuitry has a hysteresis of about 15°C. Once the silicon junction temperature has decreased to approximately 150°C, the device starts to switch again. Knowing this, the RθJA for any application can be characterized during the early stages of the design one may calculate the RθJA by placing the PCB circuit into a thermal chamber. Raise the ambient temperature in the given working application until the circuit enters thermal shutdown. If the SW pin is monitored, it is obvious when the internal FETs stop switching, indicating a junction temperature of 165°C. Knowing the internal power dissipation from the above methods, the junction temperature, and the ambient temperature RθJA can be determined.

Equation 40. LM26420-Q1 30069676.gif

Once this is determined, the maximum ambient temperature allowed for a desired junction temperature can be found.

An example of calculating RθJA for an application using the LM26420-Q1 WQFN demonstration board is shown below.

The four layer PCB is constructed using FR4 with 1 oz copper traces. The copper ground plane is on the bottom layer. The ground plane is accessed by eight vias. The board measures 3 cm × 3 cm. It was placed in an oven with no forced airflow. The ambient temperature was raised to 152°C, and at that temperature, the device went into thermal shutdown.

From the previous example:

 

Equation 41. PINTERNAL = 304 mW

 

Equation 42. LM26420-Q1 30069677.gif

If the junction temperature was to be kept below 125°C, then the ambient temperature could not go above 112°C.

Equation 43. TJ – (RθJA × PINTERNAL) = TA
Equation 44. 125°C – (42.8°C/W × 304 mW) = 112.0°C