SNIS144G July 2007 – September 2016 LM26LV , LM26LV-Q1
PRODUCTION DATA.
PIN | TYPE | DESCRIPTION | EQUIVALENT CIRCUIT | |
---|---|---|---|---|
NAME | NO. | |||
GND | 2 | GND | Power supply ground | — |
OVERTEMP | 5 | O | Overtemperature switch output. Active high, push-pull. Asserted when the measured temperature exceeds the trip point temperature or if TRIP_TEST = 1. This pin may be left open if not used. |
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OVERTEMP | 3 | O | Overtemperature switch output. Active low, open-drain (See Determining the Pullup Resistor Value). Asserted when the measured temperature exceeds the trip point temperature or if TRIP_TEST = 1. This pin may be left open if not used. |
|
TRIP_TEST | 1 | I | TRIP_TEST pin. Active high input. If TRIP_TEST = 0 (Default) then: VTEMP = VTS, temperature sensor output voltage. If TRIP_TEST = 1 then: OVERTEMP and OVERTEMP outputs are asserted and VTEMP = VTRIP, temperature trip voltage. This pin may be left open if not used. |
|
VDD | 4 | PWR | Positive supply voltage | — |
VTEMP | 6 | O | VTEMP analog voltage output. If TRIP_TEST = 0 then: VTEMP = VTS, temperature sensor output voltage. If TRIP_TEST = 1 then: VTEMP = VTRIP, temperature trip voltage. This pin may be left open if not used. |
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Thermal Pad | — | — | The best thermal conductivity between the device and the PCB is achieved by soldering the DAP of the package to the thermal pad on the PCB. The thermal pad can be a floating node. However, for improved noise immunity the thermal pad must be connected to the circuit GND node, preferably directly to pin 2 (GND) of the device. | — |