JAJSA30G November   2002  – May 2019 LM2733

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーション回路
      2.      効率と負荷電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switching Frequency
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Pin Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the External Capacitors
        2. 8.2.2.2  Selecting the Output Capacitor
        3. 8.2.2.3  Selecting the Input Capacitor
        4. 8.2.2.4  Feedforward Compensation
        5. 8.2.2.5  Selecting Diodes
        6. 8.2.2.6  Setting the Output Voltage
        7. 8.2.2.7  Switching Frequency
        8. 8.2.2.8  Duty Cycle
        9. 8.2.2.9  Inductance Value
        10. 8.2.2.10 Maximum Switch Current
        11. 8.2.2.11 Calculating Load Current
        12. 8.2.2.12 Design Parameters VSW and ISW
        13. 8.2.2.13 Thermal Considerations
        14. 8.2.2.14 Minimum Inductance
        15. 8.2.2.15 Inductor Suppliers
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 商標
    2. 11.2 静電気放電に関する注意事項
    3. 11.3 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

High frequency switching regulators require very careful layout of components in order to get stable operation and low noise. All components must be as close as possible to the LM2733 device. It is recommended that a 4-layer PCB be used so that internal ground planes are available.

Some additional guidelines to be observed:

  1. Keep the path between L1, D1, and C2 extremely short. Parasitic trace inductance in series with D1 and C2 will increase noise and ringing.
  2. The feedback components R1, R2 and CF must be kept close to the FB pin of U1 to prevent noise injection on the FB pin trace.
  3. If internal ground planes are available (recommended) use vias to connect directly to ground at pin 2 of U1, as well as the negative sides of capacitors C1 and C2.