SLCS144F July 2004 – December 2024 LM317L
PRODUCTION DATA
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THERMAL METRIC(1) | LM317L | UNIT | |||||||
---|---|---|---|---|---|---|---|---|---|
D 8 PINS | LP 3 PINS | PK 3 PINS | PW 8 PINS | ||||||
Legacy Chip(2) | New Chip | Legacy Chip(2) | New Chip | Legacy Chip(2) | New Chip | Legacy Chip(2) | |||
RθJA | Junction-to-ambient thermal resistance | 97.1 | 96.5 | 139.5 | 156.7 | 51.5 | 44 | 149.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 48.6 | 80.6 | 86.9 | |||||
RθJB | Junction-to-board thermal resistance | 34.8 | 8.5 | ||||||
ΨJT | Junction-to-top characterization parameter | 5.9 | 24.7 | 4.5 | |||||
ΨJB | Junction-to-board characterization parameter | 34.2 | 135.8 | 8.5 | |||||
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.9 |