SNVS606L June   2009  – December 2014 LM3530

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 I2C Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C-Compatible Timing Requirements (SCL, SDA)
    7. 7.7 Simple Interface Timing
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Start-Up
      2. 8.3.2  Light Load Operation
      3. 8.3.3  Ambient Light Sensor
      4. 8.3.4  ALS Operation
      5. 8.3.5  ALS Averaging Time
        1. 8.3.5.1 Averager Operation
      6. 8.3.6  Zone Boundary Settings
      7. 8.3.7  Zone Boundary Trip Points and Hysteresis
      8. 8.3.8  Minimum Zone Boundary Settings
      9. 8.3.9  LED Current Control
      10. 8.3.10 Exponential or Linear Brightness Mapping Modes
      11. 8.3.11 PWM Input Polarity
      12. 8.3.12 I2C-Compatible Current Control Only
      13. 8.3.13 Simple Enable Disable With PWM Current Control
      14. 8.3.14 Ambient Light Current Control
      15. 8.3.15 Ambient Light Current Control + PWM
      16. 8.3.16 Interrupt Output
      17. 8.3.17 Overvoltage Protection
      18. 8.3.18 Hardware Enable
      19. 8.3.19 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
      2. 8.4.2 I2C Mode
      3. 8.4.3 PWM + I2C Mode
      4. 8.4.4 ALS Mode
      5. 8.4.5 Simple Enable Mode
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Interface
        1. 8.5.1.1 Start and Stop Condition
        2. 8.5.1.2 I2C-Compatible Address
        3. 8.5.1.3 Transferring Data
    6. 8.6 Register Maps
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1 General Configuration Register (GP)
        2. 8.6.1.2 ALS Configuration Register
        3. 8.6.1.3 Brightness Ramp Rate Register
        4. 8.6.1.4 ALS Zone Information Register
        5. 8.6.1.5 ALS Resistor Select Register
        6. 8.6.1.6 Brightness Control Register
        7. 8.6.1.7 Zone Boundary Register
        8. 8.6.1.8 Zone Target Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 LED Current Setting/Maximum LED Current
        2. 9.2.2.2 Maximum Duty Cycle
        3. 9.2.2.3 Peak Current Limit
        4. 9.2.2.4 Output Voltage Limitations
        5. 9.2.2.5 Output Capacitor Selection
        6. 9.2.2.6 Inductor Selection
        7. 9.2.2.7 Diode Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Output Capacitor Placement
      2. 11.1.2 Schottky Diode Placement
      3. 11.1.3 Inductor Placement
      4. 11.1.4 Input Capacitor Selection and Placement
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation, see the following:

Texas Instruments Application Note 1112: DSBGA Wafer Level Chip Scale Package (SNVA009).

12.3 Trademarks

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.