SNVSAF2A February   2016  – February 2016 LM36922H

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enabling the LM36922H
        1. 7.3.1.1 Current Sink Enable
      2. 7.3.2 LM36922H Start-Up
      3. 7.3.3 Brightness Mapping
        1. 7.3.3.1 Linear Mapping
        2. 7.3.3.2 Exponential Mapping
      4. 7.3.4 PWM Input
        1. 7.3.4.1 PWM Sample Frequency
          1. 7.3.4.1.1 PWM Resolution and Input Frequency Range
          2. 7.3.4.1.2 PWM Sample Rate and Efficiency
            1. 7.3.4.1.2.1 PWM Sample Rate Example
        2. 7.3.4.2 PWM Hysteresis
        3. 7.3.4.3 PWM Step Response
        4. 7.3.4.4 PWM Timeout
      5. 7.3.5 LED Current Ramping
      6. 7.3.6 Regulated Headroom Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Brightness Control Modes
        1. 7.4.1.1 I2C Only (Brightness Mode 00)
        2. 7.4.1.2 PWM Only (Brightness Mode 01)
        3. 7.4.1.3 I2C + PWM Brightness Control (Multiply Then Ramp) Brightness Mode 10
        4. 7.4.1.4 I2C + PWM Brightness Control (Ramp Then Multiply) Brightness Mode 11
      2. 7.4.2 Boost Switching Frequency
        1. 7.4.2.1 Minimum Inductor Select
      3. 7.4.3 Auto-Switching Frequency
      4. 7.4.4 I2C Address Select (ASEL)
      5. 7.4.5 Fault Protection/Detection
        1. 7.4.5.1 Overvoltage Protection (OVP)
          1. 7.4.5.1.1 Case 1 OVP Fault Only (OVP Threshold Hit and All Enabled Current Sink Inputs > 40 mV)
          2. 7.4.5.1.2 Case 2a OVP Fault and Open LED String Fault (OVP Threshold Occurrence and Any Enabled Current Sink Input ≤ 40 mV)
          3. 7.4.5.1.3 Case 2b OVP Fault and Open LED String Fault (OVP Threshold Duration and Any Enabled Current Sink Input ≤ 40 mV)
          4. 7.4.5.1.4 OVP/LED Open Fault Shutdown
          5. 7.4.5.1.5 Testing for LED String Open
        2. 7.4.5.2 Voltage Limitations on LED1, LED2
        3. 7.4.5.3 LED String Short Fault
        4. 7.4.5.4 Overcurrent Protection (OCP)
          1. 7.4.5.4.1 OCP Fault
          2. 7.4.5.4.2 OCP Shutdown
        5. 7.4.5.5 Device Overtemperature
          1. 7.4.5.5.1 Overtemperature Shutdown
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Start and Stop Conditions
        2. 7.5.1.2 I2C Address
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 Register Programming
    6. 7.6 Register Maps
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1 Inductor
          2. 8.2.2.1.2 Output Capacitor
          3. 8.2.2.1.3 Input Capacitor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Input Supply Bypassing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Inductor Placement
      4. 10.1.4 Boost Input Capacitor Placement
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Community Resources
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.