JAJSF96C April   2018  – October 2021 LM5036

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Voltage Start-Up Regulator
      2. 7.3.2  Undervoltage Lockout (UVLO)
      3. 7.3.3  Reference Regulator
      4. 7.3.4  Oscillator, Synchronized Input
      5. 7.3.5  Voltage-Mode Control
      6. 7.3.6  Primary-Side Gate Driver Outputs (LSG and HSG)
      7. 7.3.7  Half-Bridge PWM Scheme
      8. 7.3.8  Maximum Duty Cycle Operation
      9. 7.3.9  Pre-Biased Start-Up Process
        1. 7.3.9.1 Primary FETs Soft-Start Process
        2. 7.3.9.2 Synchronous Rectifier (SR) Soft-Start Process
      10. 7.3.10 Zero Duty Cycle Operation
      11. 7.3.11 Enhanced Cycle-by-Cycle Current Limiting with Pulse Matching
      12. 7.3.12 Reverse Current Protection
      13. 7.3.13 CBC Threshold Accuracy
      14. 7.3.14 Hiccup Mode Protection
      15. 7.3.15 Hiccup Mode Blanking
      16. 7.3.16 Over-Temperature Protection (OTP)
      17. 7.3.17 Over-Voltage / Latch (ON_OFF Pin)
      18. 7.3.18 Auxiliary Constant On-Time Control
      19. 7.3.19 Auxiliary On-Time Generator
      20. 7.3.20 Auxiliary Supply Current Limiting
      21. 7.3.21 Auxiliary Primary Output Capacitor Ripple
      22. 7.3.22 Auxiliary Ripple Configuration and Control
      23. 7.3.23 Asynchronous Mode Operation of Auxiliary Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Input Transient Protection
        3. 8.2.2.3  Level-Shift Detection Circuit
        4. 8.2.2.4  Applications with VIN > 100-V
        5. 8.2.2.5  Applications without Pre-Biased Start-Up Requirement
        6. 8.2.2.6  UVLO Voltage Divider Selection
        7. 8.2.2.7  Over Voltage, Latch (ON_OFF Pin) Voltage Divider Selection
        8. 8.2.2.8  SS Capacitor
        9. 8.2.2.9  SSSR Capacitor
        10. 8.2.2.10 Half-Bridge Power Stage Design
        11. 8.2.2.11 Current Limit
        12. 8.2.2.12 Auxiliary Transformer
        13. 8.2.2.13 Auxiliary Feedback Resistors
        14. 8.2.2.14 RON Resistor
        15. 8.2.2.15 VIN Pin Capacitor
        16. 8.2.2.16 Auxiliary Primary Output Capacitor
        17. 8.2.2.17 Auxiliary Secondary Output Capacitor
        18. 8.2.2.18 Auxiliary Feedback Ripple Circuit
        19. 8.2.2.19 Auxiliary Secondary Diode
        20. 8.2.2.20 VCC Diode
        21. 8.2.2.21 Opto-Coupler Interface
        22. 8.2.2.22 Full-Bridge Converter Applications
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
        1. 11.2.1.1 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC (1) LM5036 UNIT
RJB (WQFN)
28 PINS
RΘJA Junction-to-ambient thermal resistance 29.9 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 18.2 °C/W
RΘJB Junction-to-board thermal resistance 10.4 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 10.3 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance 1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.