JAJSV63A August 2024 – August 2024 LM5137-Q1
ADVANCE INFORMATION
100% automated visual inspection (AVI) post-assembly is typically required to meet requirements for high reliability and robustness. Standard quad-flat no-lead (QFN) packages do not have solderable or exposed pins and terminals that are easily viewed. Visually determining whether or not the package is successfully soldered onto the printed-circuit board (PCB) is therefore difficult. The wettable-flank process was developed to resolve the issue of side-lead wetting of leadless packaging. The LM5137-Q1 is assembled using a 36-pin VQFN package with wettable flanks to provide a visual indicator of solderability, which reduces inspection time and manufacturing costs.