JAJSG75B September   2018  – April 2024 LM5164-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Control Architecture
      2. 6.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 6.3.3  Regulation Comparator
      4. 6.3.4  Internal Soft Start
      5. 6.3.5  On-Time Generator
      6. 6.3.6  Current Limit
      7. 6.3.7  N-Channel Buck Switch and Driver
      8. 6.3.8  Synchronous Rectifier
      9. 6.3.9  Enable/Undervoltage Lockout (EN/UVLO)
      10. 6.3.10 Power Good (PGOOD)
      11. 6.3.11 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
      3. 6.4.3 Sleep Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Switching Frequency (RRON)
        3. 7.2.2.3 Buck Inductor (LO)
        4. 7.2.2.4 Output Capacitor (COUT)
        5. 7.2.2.5 Input Capacitor (CIN)
        6. 7.2.2.6 Type-3 Ripple Network
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Compact PCB Layout for EMI Reduction
        2. 7.4.1.2 Feedback Resistors
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 サード・パーティ製品に関する免責事項
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 ドキュメントの更新通知を受け取る方法
    4. 8.4 サポート・リソース
    5. 8.5 Trademarks
    6. 8.6 静電気放電に関する注意事項
    7. 8.7 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) LM5164-Q1UNIT
DDA (SOIC)
8 PINS
RθJAJunction-to-ambient thermal resistance41.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance37.3°C/W
RθJBJunction-to-board thermal resistance30.6°C/W
ΨJTJunction-to-top characterization parameter6.7°C/W
ΨJBJunction-to-board characterization parameter24.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance2.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.