JAJSVQ2 November   2024 LM644A2-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1. 5.1 Wettable Flanks
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN)
      2. 7.3.2  Enable EN Pin and Use as VIN UVLO
      3. 7.3.3  Output Voltage Selection and Soft Start
      4. 7.3.4  SYNC Allows Clock Synchronization and Mode Selection
      5. 7.3.5  Clock Locking
      6. 7.3.6  Adjustable Switching Frequency
      7. 7.3.7  Power-Good Output Voltage Monitoring
      8. 7.3.8  Internal LDO, VCC UVLO, and BIAS Input
      9. 7.3.9  Bootstrap Voltage and VCBOOT-UVLO (CB1 and CB2 Pin)
      10. 7.3.10 CONFIG Device Configuration Pin
      11. 7.3.11 Spread Spectrum
      12. 7.3.12 Soft Start and Recovery From Dropout
      13. 7.3.13 Overcurrent and Short-Circuit Protection
      14. 7.3.14 Hiccup
      15. 7.3.15 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 Peak Current Mode Operation
        2. 7.4.3.2 Auto Mode Operation
          1. 7.4.3.2.1 Diode Emulation
        3. 7.4.3.3 FPWM Mode Operation
        4. 7.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
        6. 7.4.3.6 Recovery from Dropout
        7. 7.4.3.7 Other Fault Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Choosing the Switching Frequency
        2. 8.2.2.2  Setting the Output Voltage
        3. 8.2.2.3  Inductor Selection
        4. 8.2.2.4  Output Capacitor Selection
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  BOOT Capacitor
        7. 8.2.2.7  VCC
        8. 8.2.2.8  CFF and RFF Selection
        9. 8.2.2.9  SYNCHRONIZATION AND MODE
        10. 8.2.2.10 External UVLO
        11. 8.2.2.11 Typical Thermal Performance
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Ground and Thermal Considerations
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Choosing the Switching Frequency

The choice of switching frequency is a compromise between conversion efficiency and overall design size. Lower switching frequency implies reduced switching losses, usually resulting in less power dissipated in the IC. Lower power dissipated in the IC results in higher system efficiency and a lower IC temperature. However, higher switching frequency allows the use of smaller inductors and output capacitors, hence, a more compact design. Many applications require that the AM band be avoided. These applications tend to operate at around 400kHz (below the AM band), or 2.1MHz (above the AM band). For 400kHz, a 39.2k 1% resistor can be used. For this 2100kHz example, a 7.15k 1% resistor is selected.