JAJSHW4 September   2019 LM74202-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      12V での ISO16750-2 ロードダンプ・パルス 5b 性能
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings
    3. 6.3      Recommended Operating Conditions
    4. Table 1. Thermal Information
    5. 6.4      Electrical Characteristics
    6. 6.5      Timing Requirements
    7. 6.6      Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Overvoltage Protection (OVP)
      3. 8.3.3 Reverse Battery Protection
      4. 8.3.4 Hot Plug-In and In-Rush Current Control
      5. 8.3.5 Overload and Short Circuit Protection
        1. 8.3.5.1 Overload Protection
          1. 8.3.5.1.1 Active Current Limiting
          2. 8.3.5.1.2 Electronic Circuit Breaker with Overload Timeout, MODE = OPEN
        2. 8.3.5.2 Short Circuit Protection
          1. 8.3.5.2.1 Start-Up With Short-Circuit On Output
        3. 8.3.5.3 FAULT Response
          1. 8.3.5.3.1 Look Ahead Overload Current Fault Indicator
        4. 8.3.5.4 Current Monitoring
        5. 8.3.5.5 IN, OUT, RTN and GND Pins
        6. 8.3.5.6 Thermal Shutdown
        7. 8.3.5.7 Low Current Shutdown Control (SHDN)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step by Step Design Procedure
        2. 9.2.2.2 Setting Undervoltage Lockout and Overvoltage Set Point for Operating Voltage Range
        3. 9.2.2.3 Programming the Current-Limit Threshold—R(ILIM) Selection
        4. 9.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 9.2.2.5 Limiting the Inrush Current
          1. 9.2.2.5.1 Selection of Input TVS for Transient Protection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.6 Typical Characteristics

TA = 25 °C, V(IN) = 12 V, V(SHDN)= 2 V, R(ILIM) = 120 kΩ, IMON = FLT = OPEN, C(IN) = 0.1 μF, C(OUT) = 1 μF, C(dVdT) = OPEN. (Unless otherwise noted)
LM74202-Q1 D001_SLVSEM1.gif
Figure 1. POR Threshold (VPOR) vs Temperature
LM74202-Q1 D003_SLVSFD0.gif
Figure 3. Supply Current OFF (IQOFF) vs Supply Voltage (VIN)
LM74202-Q1 D005_SLVSEM1.gif
Figure 5. OVP Thresholds (VOVPR, VOVPF) vs Temperature
LM74202-Q1 D007_SLVSEM1.gif
Figure 7. ILIM vs RILIM
LM74202-Q1 D009_SLVSEM1.gif
Figure 9. ILIM Accuracy vs Temperature with VIN = 12 V
LM74202-Q1 D011_SLVSEM1.gif
Figure 11. IMON vs IOUT
LM74202-Q1 D013_SLVSEM1.gif
V(OUT) = 24 V V(IN) = 0 V VSHDN = 0 V
Figure 13. Ilkg(OUT) vs Temperature with VIN = 0 V
LM74202-Q1 D015_SLVSEM1.gif
Figure 15. VREVTH vs Temperature
LM74202-Q1 D017_SLVSEM1.gif
Figure 17. ILIM Accuracy vs Temperature with VIN = 24 V
LM74202-Q1 D002_SLVSFD0.gif
Figure 2. Supply Current ON (IQON) vs Supply Voltage (VIN)
LM74202-Q1 D004_SLVSEM1.gif
Figure 4. UVLO Thresholds (VUVLOR, VUVLOF) vs Temperature
LM74202-Q1 D006_SLVSEM1.gif
Figure 6. GAIN(dVdT) vs Temperature
LM74202-Q1 D008_SLVSFD0.gif
TA = -40 to 125 °C
Figure 8. ILIM Accuracy vs Supply Voltage
LM74202-Q1 D010_SLVSEM1.gif
Figure 10. GAIN(IMON) vs Temperature
LM74202-Q1 D012_SLVSEM1.gif
Figure 12. RON vs Temperature
LM74202-Q1 D014_SLVSEM1.gif
V(OUT) = 0 V V(IN) = –24 V VSHDN = 0 V
Figure 14. Ilkg(OUT) vs Temperature with VIN = –24 V
LM74202-Q1 D016_SLVSEM1.gif
Figure 16. VFWDTH vs Temperature
LM74202-Q1 D018_SLVSEM1.gif
Taken on 2-layer PCB with 0.07-mm thick copper and copper area of 10.5 cm2 connected to PowerPAD.
Figure 18. Thermal Shutdown Time vs Power Dissipation