JAJSF08G October   2017  – December 2020 LM74700-Q1

PRODMIX  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Voltage
      2. 9.3.2 Charge Pump
      3. 9.3.3 Gate Driver
      4. 9.3.4 Enable
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Conduction Mode
        1. 9.4.2.1 Regulated Conduction Mode
        2. 9.4.2.2 Full Conduction Mode
        3. 9.4.2.3 Reverse Current Protection Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
        2. 10.1.1.2 Detailed Design Procedure
          1. 10.1.1.2.1 Design Considerations
          2. 10.1.1.2.2 MOSFET Selection
          3. 10.1.1.2.3 Charge Pump VCAP, input and output capacitance
        3. 10.1.1.3 Selection of TVS Diodes for 12-V Battery Protection Applications
        4. 10.1.1.4 Selection of TVS Diodes and MOSFET for 24-V Battery Protection Applications
        5. 10.1.1.5 Application Curves
    2. 10.2 OR-ing Application Configuration
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 ドキュメントの更新通知を受け取る方法
    2. 13.2 サポート・リソース
    3. 13.3 Trademarks
    4. 13.4 静電気放電に関する注意事項
    5. 13.5 用語集
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)LM74700-Q1LM74700-Q1UNIT
DBV (SOT)DDF (SOT)
6 PINS8 PINS
RθJAJunction-to-ambient thermal resistance189.8133.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance103.872.6°C/W
RθJBJunction-to-board thermal resistance45.854.5°C/W
ΨJTJunction-to-top characterization parameter19.44.6°C/W
ΨJBJunction-to-board characterization parameter45.554.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.