JAJSAR0B March   2007  – October 2017 LM95214

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     リモート1温度エラー、TA＝TD
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Temperature-to-Digital Converter
    6. 7.6 Logic Electrical Characteristics: Digital DC Characteristics
    7. 7.7 Switching Characteristics: SMBus Digital
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Conversion Sequence
      2. 8.3.2 Power-On-Default States
      3. 8.3.3 SMBus Interface
      4. 8.3.4 Temperature Conversion Sequence
        1. 8.3.4.1 Digital Filter
      5. 8.3.5 Fault Queue
      6. 8.3.6 Temperature Data Format
      7. 8.3.7 SMBDAT Open-Drain Output
      8. 8.3.8 TCRIT1, TCRIT2, and TCRIT3 Outputs
      9. 8.3.9 TCRIT Limits and TCRIT Outputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Diode Fault Detection
      2. 8.4.2 Communicating With the LM95214
      3. 8.4.3 Serial Interface Reset
      4. 8.4.4 One-Shot Conversion
    5. 8.5 Register Maps
      1. 8.5.1 LM95214 Registers
        1. 8.5.1.1 Value Registers
          1. 8.5.1.1.1 Local Value Registers
          2. 8.5.1.1.2 Remote Temperature Value Registers With Signed Format
          3. 8.5.1.1.3 Remote Temperature Value Registers With Unsigned Format
        2. 8.5.1.2 Diode Configuration Register
          1. 8.5.1.2.1 Remote 1-4 Offset
        3. 8.5.1.3 Configuration Registers
          1. 8.5.1.3.1 Main Configuration Register
          2. 8.5.1.3.2 Conversion Rate Register
          3. 8.5.1.3.3 Channel Conversion Enable
          4. 8.5.1.3.4 Filter Setting
          5. 8.5.1.3.5 1-Shot
        4. 8.5.1.4 Status Registers
          1. 8.5.1.4.1 Common Status Register
          2. 8.5.1.4.2 Status 1 Register (Diode Fault)
          3. 8.5.1.4.3 Status 2 (TCRIT1)
          4. 8.5.1.4.4 Status 3 (TCRIT2)
          5. 8.5.1.4.5 Status 4 (TCRIT3)
        5. 8.5.1.5 Mask Registers
          1. 8.5.1.5.1 TCRIT1 Mask Register
          2. 8.5.1.5.2 TCRIT2 Mask Registers
          3. 8.5.1.5.3 TCRIT3 Mask Register
        6. 8.5.1.6 Limit Registers
          1. 8.5.1.6.1 Local Limit Register
          2. 8.5.1.6.2 Remote Limit Registers
          3. 8.5.1.6.3 Common Tcrit Hysteresis Register
        7. 8.5.1.7 Identification Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
    3. 9.3 Diode Non-Ideality
      1. 9.3.1 Diode Non-Ideality Factor Effect on Accuracy
      2. 9.3.2 Calculating Total System Accuracy
      3. 9.3.3 Compensating for Different Non-Ideality
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.1 Application Information

The LM95214 can be applied easily in the same way as other integrated-circuit temperature sensors, and its remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed-circuit board, and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively be that of the printed-circuit board lands and traces soldered to the LM95214's pins. This presumes that the ambient air temperature is almost the same as the surface temperature of the printed-circuit board; if the air temperature is much higher or lower than the surface temperature, the actual temperature of the LM95214 die will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much more strongly than will the air temperature.