SNOS694I March   1995  – September 2015 LMC6001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics for LMC6001AI
    6. 6.6  DC Electrical Characteristics for LMC6001BI
    7. 6.7  DC Electrical Characteristics for LMC6001CI
    8. 6.8  AC Electrical Characteristics for LMC6001AIC
    9. 6.9  AC Electrical Characteristics for LM6001BI
    10. 6.10 AC Electrical Characteristics for LMC6001CI
    11. 6.11 Dissipation Ratings
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Amplifier Topology
      2. 7.3.2 Latch-Up Prevention
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Compensating For Input Capacitance
      2. 8.1.2 Capacitive Load Tolerance
    2. 8.2 Typical Application
      1. 8.2.1 Two Op Amp, Temperature Compensated Ph Probe Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Example
      1. 8.3.1 Ultra-Low Input Current Instrumentation Amplifier
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Printed-Circuit-Board Layout For High-Impedance Work
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

4 Revision History

Changes from H Revision (March 2013) to I Revision

  • Added Pin Functions table ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Timing Requirements table, Switching Characteristics table, Feature Description section, Device Functional Modes, Parameter Measurement Information section, Detailed Description section, Register Maps section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go

Changes from F Revision (March 2013) to H Revision

  • Changed layout of National Data Sheet to TI formatGo