SNLS233O April 2007 – July 2015 LMH0344
PRODUCTION DATA.
For additional information, see the following:
Application Note AN- 1187, Leadless Leadframe Package (LLP) (SNOA401).
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
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