JAJSFL5D April   2016  – June 2018 LMH1219

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     ブロック概略図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Recommended SMBus Interface AC Timing Specifications
    7. 7.7 Serial Parallel Interface (SPI) AC Timing Specifications
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  4-Level Input Configuration Pins
      2. 8.3.2  Input Carrier Detect
      3. 8.3.3  -6 dB Splitter Mode Launch Amplitude for IN0
      4. 8.3.4  Continuous Time Linear Equalizer (CTLE)
        1. 8.3.4.1 Adaptive Cable Equalizer (IN0+)
        2. 8.3.4.2 Adaptive PCB Trace Equalizer (IN1±)
      5. 8.3.5  Input-Output Mux Selection
      6. 8.3.6  Clock and Data Recovery (CDR) Reclocker
      7. 8.3.7  Internal Eye Opening Monitor (EOM)
      8. 8.3.8  Output Function Control
      9. 8.3.9  Output Driver Amplitude and De-Emphasis Control
      10. 8.3.10 Status Indicators and Interrupts
        1. 8.3.10.1 LOCK_N (Lock Indicator)
        2. 8.3.10.2 CD_N (Carrier Detect)
        3. 8.3.10.3 INT_N (Interrupt)
      11. 8.3.11 Additional Programmability
        1. 8.3.11.1 Cable Length Indicator (CLI)
        2. 8.3.11.2 Digital MUTEREF
    4. 8.4 Device Functional Modes
      1. 8.4.1 System Management Bus (SMBus) Mode
        1. 8.4.1.1 SMBus Read and Write Transactions
          1. 8.4.1.1.1 SMBus Write Operation Format
          2. 8.4.1.1.2 SMBus Read Operation Format
      2. 8.4.2 Serial Peripheral Interface (SPI) Mode
        1. 8.4.2.1 SPI Read and Write Transactions
          1. 8.4.2.1.1 SPI Write Transaction Format
          2. 8.4.2.1.2 SPI Read Transaction Format
        2. 8.4.2.2 SPI Daisy Chain
    5. 8.5 LMH1219 Register Map
      1. 8.5.1 Share Register Page
      2. 8.5.2 CTLE/CDR Register Page
      3. 8.5.3 CableEQ/Drivers Register Page
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 General Guidance for SMPTE and 10 GbE Applications
      2. 9.1.2 Optimizing Time to Adapt and Lock
      3. 9.1.3 LMH1219 and LMH0324 Compatibility
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detail Design Procedure
      3. 9.2.3 Recommended VOD and DEM Register Settings
      4. 9.2.4 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 PCB Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.2.2 Detail Design Procedure

The following general design procedure is recommended:

  1. Select a suitable power supply voltage for the LMH1219. See Power Supply Recommendations for details.
  2. Check that the power supply meets the DC and AC requirements in Recommended Operating Conditions.
  3. Select the proper pull-high or pull-low resistors for IN_OUT_SEL and OUT_CTRL for setting the signal path.
  4. If -6 dB launch amplitude or other expanded programmable features are needed, select the use of SPI or SMBus by setting Level-F or Level-L for MODE_SEL, respectively.
  5. Choose a high quality 75-Ω BNC that is capable of supporting 11.88 Gbps applications. Consult a BNC supplier regarding insertion loss, impedance specifications, and recommended footprint for meeting SMPTE return loss.
  6. Depending on the length and insertion loss of the output traces for OUT0± and OUT1±, select the proper pull-high or pull-low resistors for VOD_DE to set the output amplitude and de-emphasis settings. Refer to Table 5 for details.
  7. Follow all design requirements detailed in Table 9 to optimize LMH1219 performance.
  8. For additional layout recommendations, refer to PCB Layout Guidelines.