SNWS020C November   2007  – October 2015 LMH2100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 2.7-V DC and AC Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Characteristics of the LMH2100
      2. 7.3.2 Accurate Power Measurement
        1. 7.3.2.1 LOG-Conformance Error
        2. 7.3.2.2 Temperature Drift Error
          1. 7.3.2.2.1 Temperature Compensation
          2. 7.3.2.2.2 Differential Power Errors
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
        1. 7.4.1.1 Output Behavior in Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Functionality and Application of RF Power Detectors
        1. 8.1.1.1 Functionality of RF Power Detectors
          1. 8.1.1.1.1 Key Characteristics of RF Power Detectors
          2. 8.1.1.1.2 Types of RF Power Detectors
            1. 8.1.1.1.2.1 Diode Detector
            2. 8.1.1.1.2.2 (Root) Mean Square Detector
            3. 8.1.1.1.2.3 Logarithmic Detectors
    2. 8.2 Typical Applications
      1. 8.2.1 Application With Transmit Power Control Loop
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Detector Interfacing
            1. 8.2.1.2.1.1 Concept of Power Measurements
            2. 8.2.1.2.1.2 RF Input
            3. 8.2.1.2.1.3 Output and Reference
              1. 8.2.1.2.1.3.1 Filtering
            4. 8.2.1.2.1.4 Interface to the ADC
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application With Voltage Standing Wave Ratio Measurement
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Supply Lines
        1. 10.1.1.1 Positive Supply (VDD)
        2. 10.1.1.2 Ground (GND)
      2. 10.1.2 RF Input Interface
      3. 10.1.3 Microstrip Configuration
      4. 10.1.4 GCPW Configuration
      5. 10.1.5 Reference (REF)
      6. 10.1.6 Output (OUT)
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply voltage, VDD to GND 3.6 V
RF input, input power 10 dBm
RF input, DC voltage 400 mV
Enable input voltage VSS – 0.4 < VEN < VDD + 0.4 V
Junction temperature (3) 150 °C
Maximum lead temperature (soldering,10 sec) 260 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For ensured specifications and the test conditions, see the 2.7-V DC and AC Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
Machine model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
Supply voltage 2.7 3.3 V
Temperature range –40 85 °C
RF frequency range 50 4000 MHz
RF input power range(2) –45
–58		 –5
–18		 dBm
dBV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For ensured specifications and the test conditions, see the 2.7-V DC and AC Electrical Characteristics.
(2) Power in dBV = dBm + 13 when the impedance is 50 Ω.

6.4 Thermal Information

THERMAL METRIC(1) LMH2100 UNIT
YFQ (DSBGA)
6 PINS
RθJA Junction-to-ambient thermal resistance (2) 133.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.7 °C/W
RθJB Junction-to-board thermal resistance 22.6 °C/W
ψJT Junction-to-top characterization parameter 5.7 °C/W
ψJB Junction-to-board characterization parameter 22.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.5 2.7-V DC and AC Electrical Characteristics

Unless otherwise specified, all limits are ensured at TA = 25°C, VDD = 2.7 V, RF input frequency ƒ = 1855 MHz CW (Continuous Wave, unmodulated). Maximum and minimum limits apply at the temperature extremes.(1).
PARAMETER TEST CONDITIONS MIN (2) TYP(3) MAX (2) UNIT
SUPPLY INTERFACE
IDD Supply current Active mode: EN = High, no signal present at RFIN 6.3 7.1 7.9 mA
Active mode: EN = High, no signal present at RFIN
TA = –40°C to +85°C		 5 9.2
Shutdown: EN = Low, no signal present at RFIN. 0.5 0.9 µA
Shutdown: EN = Low, no signal present at RFIN.
TA = –40°C to +85°C		 1.9
EN = Low: PIN = 0 dBm(4)
TA = –40°C to +85°C		 10
LOGIC ENABLE INTERFACE
VLOW EN logic low input level (Shutdown Mode) TA = –40°C to +85°C 0.6 V
VHIGH EN logic high input level TA = –40°C to +85°C 1.1 V
IEN Current into EN pin TA = –40°C to +85°C 60 nA
RF INPUT INTERFACE
RIN Input resistance 46.7 51.5 56.4 Ω
OUTPUT INTERFACE
VOUT Output voltage swing From positive rail, sourcing,
VREF = 0 V, IOUT = 1 mA		 15.3 23.9 mV
From positive rail, sourcing,
VREF = 0 V, IOUT = 1 mA
TA = –40°C to +85°C		 28.9
From negative rail, sinking,
VREF = 2.7 V, IOUT = 1 mA		 13.1 22.3
From negative rail, sinking,
VREF = 2.7 V, IOUT = 1 mA
TA = –40°C to +85°C		 28.3
IOUT Output short circuit current Sourcing, VREF = 0 V, VOUT = 2.6 V 5.8 7.3 mA
Sourcing, VREF = 0 V, VOUT = 2.6 V
TA = –40°C to +85°C		 5.2
Sinking, VREF = 2.7 V, VOUT = 0.1 V 6.2 8.3
Sinking, VREF = 2.7 V, VOUT = 0.1 V
TA = –40°C to +85°C		 5.4
BW Small signal bandwidth No RF input signal. Measured from REF input current to VOUT 416 kHz
RTRANS Output amp transimpedance gain No RF input signal, from IREF to VOUT, DC 40.7 43.3 46.7 kΩ
SR Slew rate Positive, VREF from 2.7 V to 0 V 3.4 3.9 V/µs
Positive, VREF from 2.7 V to 0 V
TA = –40°C to +85°C		 3.3
Negative, VREF from 0 V to 2.7 V 3.8 4.4
Negative, VREF from 0 V to 2.7 V
TA = –40°C to +85°C		 3.7
ROUT Output impedance(5) No RF input signal, EN = High, DC measurement 0.2 1.8 Ω
No RF input signal, EN = High, DC measurement 4
IOUT,SD Output leakage current in shutdown mode EN = Low, VOUT = 2 V
TA = –40°C to +85°C
100		 nA
RF DETECTOR TRANSFER
VOUT,MAX Maximum output voltage
PIN= −5 dBm(5)		 ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C 1.69 1.77 1.82 V
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C 1.67 1.78 1.83
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C 1.57 1.65 1.70
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C 1.47 1.55 1.60
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C 1.38 1.46 1.51
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C 1.25 1.34 1.40
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C 1.16 1.25 1.30
VOUT,MIN Minimum output voltage (pedestal) No input signal 207 266 324 mV
No input signal, TA = –40°C to +85°C 173 365
ΔVOUT Output voltage range
PIN from −45 dBm to −5 dBm(5)		 ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C 1.38 1.44 1.49 V
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C 1.34 1.43 1.46
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C 1.27 1.32 1.36
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C 1.19 1.23 1.27
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C 1.11 1.16 1.19
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C 1 1.05 1.1
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C 0.91 0.97 1.01
KSLOPE Logarithmic slope(5) ƒ = 50 MHz 39.6 40.9 42.1 mV/dB
ƒ = 900 MHz 37.0 38.2 39.4
ƒ = 1855 MHz 34.5 35.5 36.5
ƒ = 2500 MHz 32.7 33.7 34.6
ƒ = 3000 MHz 31.1 32.1 33.1
ƒ = 3500 MHz 29.7 30.7 31.6
f = 4000 MHz 28.5 29.4 30.3
PINT Logarithmic intercept(5) ƒ = 50 MHz –50.2 −49.5 –48.8 dBm
ƒ = 900 MHz –53.6 −52.7 –51.8
ƒ = 1855 MHz –53.2 −52.3 –51.4
ƒ = 2500 MHz –52.4 −51.2 –50.1
ƒ = 3000 MHz –51.2 −50.1 –48.9
ƒ = 3500 MHz –49.1 −47.8 –46.4
ƒ = 4000 MHz –47.3 −46.1 –44.9
en Output referred noise(6) PIN = −10 dBm at 10 kHz 1.5 µV/√Hz
vN Output referred noise(5) Integrated over frequency band, 1 kHz to 6.5 kHz 100 µVRMS
Integrated over frequency band, 1 kHz to 6.5 kHz
TA = –40°C to +85°C		 150
PSRR Power supply rejection ratio(6) PIN = −10 dBm, ƒ = 1800 MHz 60 dB
PIN = −10 dBm, ƒ = 1800 MHz
TA = –40°C to +85°C		 55
POWER MEASUREMENT PERFORMANCE
ELC Log conformance error(5)
−40 dBm ≤ PIN ≤ −10 dBm		 ƒ = 50 MHz –0.2 0.12 1.2 dB
ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C –0.8 1.3
ƒ = 900 MHz –0.4 –0.06 0.2
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C –1 0.3
ƒ = 1855 MHz –0.3 -0.03 0.3
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C –0.7 0.4
ƒ = 2500 MHz –0.2 0.04 0.8
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C –0.8 1.1
ƒ = 3000 MHz –0.1 0.13 1.6
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C 1 1.8
ƒ = 3500 MHz -0.036 0.35 3.3
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C –1 3.5
ƒ = 4000 MHz –0.048 0.65 4.6
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C –1 4.9
EVOT Variation over temperature(5)
−40 dBm ≤ PIN ≤ −10 dBm		 ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C –0.63 0.43 dB
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C –0.94 0.30
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C –0.71 0.33
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C –0.88 0.35
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C –1.03 0.37
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C –1.10 0.33
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C –1.12 0.33
E1 dB Measurement Error for a 1-dB Input power step(5)
−40 dBm ≤ PIN ≤ −10 dBm		 ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C –0.064 0.066 dB
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C –0.123 0.051
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C –0.050 0.067
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C –0.058 0.074
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C –0.066 0.069
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C –0.082 0.066
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C –0.098 0.072
E10 dB Measurement Error for a 10-dB Input power step (5)
−40 dBm ≤ PIN ≤ −10 dBm		 ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C –0.40 0.27 dB
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C –0.58 0.22
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C –0.29 0.20
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C –0.28 0.24
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C –0.38 0.29
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C –0.60 0.40
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C –0.82 0.43
ST Temperature sensitivity
–40°C < TA < 25°C
−40 dBm ≤ PIN ≤ −10 dBm(5)		 ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C –6.5 8.6 mdB/°C
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C –4.7 14.5
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C –5.1 11.0
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C –4.3 13.6
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C –1.5 15.8
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C 0.1 16.9
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C 0.5 17.3
ST Temperature sensitivity
25°C < TA < 85°C
−40 dBm ≤ PIN ≤ −10 dBm(5)		 ƒ = 50 MHz, MIN at TA = –40°C to +85°C –10.5 0.5 mdB/°C
ƒ = 900 MHz, MIN at TA = –40°C to +85°C –10.5 2.6
ƒ = 1855 MHz, MIN at TA = –40°C to +85°C –11.3 3.4
ƒ = 2500 MHz, MIN at TA = –40°C to +85°C –10.6 5.8
ƒ = 3000 MHz, MIN at TA = –40°C to +85°C –11.2 6.1
ƒ = 3500 MHz, MIN at TA = –40°C to +85°C –12.9 5.5
ƒ = 4000 MHz, MIN at TA = –40°C to +85°C –17.8 5.5
ST Temperature sensitivity
−40°C < TA < 25°C(5)
PIN = −10 dBm		 ƒ = 50 MHz, MAX at TA = –40°C to +85°C –5.4 8.6 mdB/°C
ƒ = 900 MHz, MAX at TA = –40°C to +85°C 0.3 14.5
ƒ = 1855 MHz, MAX at TA = –40°C to +85°C –3.1 11.0
ƒ = 2500 MHz, MAX at TA = –40°C to +85°C –1.6 13.6
ƒ = 3000 MHz, MAX at TA = –40°C to +85°C 0.9 15.8
ƒ = 3500 MHz, MAX at TA = –40°C to +85°C 2.5 16.9
ƒ = 4000 MHz, MAX at TA = –40°C to +85°C 2.7 17.3
ST Temperature sensitivity
25°C < TA < 85°C(5)
PIN = −10 dBm		 ƒ = 50 MHz, MIN and MAX at TA = –40°C to +85°C –10.5 0.5 mdB/°C
ƒ = 900 MHz, MIN and MAX at TA = –40°C to +85°C –10.5 2.6
ƒ = 1855 MHz, MIN and MAX at TA = –40°C to +85°C –11.3 3.3
ƒ = 2500 MHz, MIN and MAX at TA = –40°C to +85°C –10.6 5.4
ƒ = 3000 MHz, MIN and MAX at TA = –40°C to +85°C –11.2 6.1
ƒ = 3500 MHz, MIN and MAX at TA = –40°C to +85°C –12.9 4.4
ƒ = 4000 MHz, MIN and MAX at TA = –40°C to +85°C –17.8 –1.1
PMAX Maximum input power for ELC = 1 dB(5) ƒ = 50 MHz, MIN at TA = –40°C to +85°C –9.2 –7.4 dBm
ƒ = 900 MHz, MIN at TA = –40°C to +85°C –10.5 –8.6
ƒ = 1855 MHz, MIN at TA = –40°C to +85°C –8.2 –6.5
ƒ = 2500 MHz, MIN at TA = –40°C to +85°C -7.3 –5.6
ƒ = 3000 MHz, MIN at TA = –40°C to +85°C –6.3 –4.4
ƒ = 3500 MHz, MIN at TA = –40°C to +85°C –6.9 –1.9
ƒ = 4000 MHz, MIN at TA = –40°C to +85°C –11.1 –7.2
PMIN Minimum input power for ELC = 1 dB(5) ƒ = 50 MHz, MAX at TA = –40°C to +85°C –38.9 –38.1 dBm
ƒ = 900 MHz, MAX at TA = –40°C to +85°C –43.1 –42.3
ƒ = 1855 MHz, MAX at TA = –40°C to +85°C –42.2 –41
ƒ = 2500 MHz, MAX at TA = –40°C to +85°C –40.6 -38.9
ƒ = 3000 MHz, MAX at TA = –40°C to +85°C –38.7 –37
ƒ = 3500 MHz, MAX at TA = –40°C to +85°C –35.9 –34.7
ƒ = 4000 MHz, MAX at TA = –40°C to +85°C –33.5 –32
DR Dynamic range for ELC = 1 dB(5) ƒ = 50 MHz, MIN at TA = –40°C to +85°C 29.5 31.6 dB
ƒ = 900 MHz, MIN at TA = –40°C to +85°C 33.3 35.2
ƒ = 1855 MHz, MIN at TA = –40°C to +85°C 34.2 36.5
ƒ = 2500 MHz, MIN at TA = –40°C to +85°C 34.1 36.1
ƒ = 3000 MHz, MIN at TA = –40°C to +85°C 33.4 35.5
ƒ = 3500 MHz, MIN at TA = –40°C to +85°C 28.5 35.1
ƒ = 4000 MHz, MIN at TA = –40°C to +85°C 22.7 26.3
(1) 2.7-V DC and AC Electrical Characteristics values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA.
(2) All limits are ensured by test or statistical analysis.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.
(4) All limits are ensured by design and measurements which are performed on a limited number of samples. Limits represent the mean ±3–sigma values.
(5) All limits are ensured by design and measurements which are performed on a limited number of samples. Limits represent the mean ±3–sigma values. The typical value represents the statistical mean value.
(6) This parameter is ensured by design and/or characterization and is not tested in production.

6.6 Timing Requirements

MIN NOM MAX UNIT
tON Turnon time, no signal at PIN, Low-High transition EN, VOUT to 90% 8.2 9.8 µs
Turnon time, no signal at PIN, Low-High transition EN, VOUT to 90%
TA = –40°C to +85°C		 12
tR Rise time(1), PIN = no signal to 0 dBm, VOUT from 10% to 90% 2 µs
Rise time(1), PIN = no signal to 0 dBm, VOUT from 10% to 90%
TA = –40°C to +85°C		 12
tF Fall time(1), PIN = no signal to 0 dBm, VOUT from 90% to 10% 2 µs
Fall time(1), PIN = no signal to 0 dBm, VOUT from 90% to 10%
TA = –40°C to +85°C		 12
(1) This parameter is ensured by design and/or characterization and is not tested in production.

6.7 Typical Characteristics

Unless otherwise specified, VDD = 2.7 V, TA = 25°C, measured on a limited number of samples.
LMH2100 30014005.gif
Figure 1. Supply Current vs Supply Voltage
LMH2100 30014046.gif
Figure 3. Log Slope vs Frequency
LMH2100 30014008.gif
Figure 2. Supply Current vs Enable Voltage
LMH2100 30014049.gif
Figure 4. Log Intercept vs Frequency
LMH2100 30014014.gif
Figure 5. Mean Output Voltage and Log Conformance Error vs
RF Input Power at 50 MHz
LMH2100 30014016.gif
Figure 7. Mean Output Voltage and Log Conformance Error vs
RF Input Power at 1855 MHz
LMH2100 30014018.gif
Figure 9. Mean Output Voltage and Log Conformance Error vs
RF Input Power at 3000 MHz
LMH2100 300140a0.gif
Figure 11. Mean Output Voltage and Log Conformance Error vs
RF Input Power at 4000 MHz
LMH2100 30014063.gif
Figure 13. Log Conformance Error (Mean ±3 sigma) vs
RF Input Power at 900 MHz
LMH2100 30014068.gif
Figure 15. Log Conformance Error (Mean ±3 sigma) vs
RF Input Power at 2500 MHz
LMH2100 30014067.gif
Figure 17. Log Conformance Error (Mean ±3 sigma) vs
RF Input Power at 3500 MHz
LMH2100 30014020.gif
Figure 19. Mean Temperature Drift Error vs
RF Input Power at 50 MHz
LMH2100 30014022.gif
Figure 21. Mean Temperature Drift Error vs
RF Input Power at 1855 MHz
LMH2100 30014024.gif
Figure 23. Mean Temperature Drift Error vs
RF Input Power at 3000 MHz
LMH2100 300140a1.gif
Figure 25. Mean Temperature Drift Error vs
RF Input Power at 4000 MHz
LMH2100 30014051.gif
Figure 27. Temperature Drift Error (Mean ±3 sigma) vs
RF Input Power at 900 MHz
LMH2100 30014053.gif
Figure 29. Temperature Drift Error (Mean ±3 sigma) vs
RF Input Power at 2500 MHz
LMH2100 30014055.gif
Figure 31. Temperature Drift Error (Mean ±3 sigma) vs
RF Input Power at 3500 MHz
LMH2100 30014026.gif
Figure 33. Error for 1 dB Input Power Step vs
RF Input Power at 50 MHz
LMH2100 30014028.gif
Figure 35. Error for 1 dB Input Power Step vs
RF Input Power at 1855 MHz
LMH2100 30014030.gif
Figure 37. Error for 1 dB Input Power Step vs
RF Input Power at 3000 MHz
LMH2100 300140a2.gif
Figure 39. Error for 1 dB Input Power step vs
RF Input Power at 4000 MHz
LMH2100 30014033.gif
Figure 41. Error for 10 dB Input Power Step vs
RF Input Power at 900 MHz
LMH2100 30014035.gif
Figure 43. Error for 10 dB Input Power Step vs
RF Input Power at 2500 MHz
LMH2100 30014037.gif
Figure 45. Error for 10 dB Input Power Step vs
RF Input Power at 3500 MHz
LMH2100 30014038.gif
Figure 47. Mean Temperature Sensitivity vs
RF Input Power at 50 MHz
LMH2100 30014040.gif
Figure 49. Mean Temperature Sensitivity vs
RF Input Power at 1855 MHz
LMH2100 30014042.gif
Figure 51. Mean Temperature Sensitivity vs
RF Input Power at 3000 MHz
LMH2100 300140a4.gif
Figure 53. Mean Temperature Sensitivity vs
RF Input power at 4000 MHz
LMH2100 30014057_nws020.gif
Figure 55. Temperature Sensitivity (Mean ±3 sigma) vs
RF Input Power at 900 MHz
LMH2100 30014059_nws020.gif
Figure 57. Temperature Sensitivity (Mean ±3 sigma) vs
RF Input Power at 2500 MHz
LMH2100 30014061_nws020.gif
Figure 59. Temperature Sensitivity (Mean ±3 sigma) vs
RF Input Power at 3500 MHz
LMH2100 30014072.gif
Figure 61. Output Voltage and Log Conformance Error vs
RF Input Power for Various Modulation Types at 900 MHz
LMH2100 30014048.gif
Figure 63. RF Input Impedance vs
Frequency (Resistance and Reactance)
LMH2100 30014047.gif
Figure 65. Power Supply Rejection Ratio vs Frequency
LMH2100 30014009.gif
Figure 67. Sourcing Output Current vs Output Voltage
LMH2100 30014011.gif
Figure 69. Output Voltage vs Sourcing Current
LMH2100 30014015.gif
Figure 6. Mean Output Voltage and Log Conformance Error vs
RF Input Power at 900 MHz
LMH2100 30014017.gif
Figure 8. Mean Output Voltage and Log Conformance Error vs
RF Input Power at 2500 MHz
LMH2100 30014019.gif
Figure 10. Mean Output Voltage and Log Conformance Error vs
RF Input Power at 3500 MHz
LMH2100 30014062.gif
Figure 12. Log Conformance Error (Mean ±3 sigma) vs
RF Input Power at 50 MHz
LMH2100 30014064.gif
Figure 14. Log Conformance Error (Mean ±3 sigma) vs
RF Input Power at 1855 MHz
LMH2100 30014069.gif
Figure 16. Log Conformance Error (Mean ±3 sigma) vs
RF Input Power at 3000 MHz
LMH2100 300140a7.gif
Figure 18. Log Conformance Error (Mean ±3 sigma) vs
RF Input Power at 4000 MHz
LMH2100 30014021.gif
Figure 20. Mean Temperature Drift Error vs
RF Input Power at 900 MHz
LMH2100 30014023.gif
Figure 22. Mean Temperature Drift Error vs
RF Input Power at 2500 MHz
LMH2100 30014025.gif
Figure 24. Mean Temperature Drift Error vs
RF Input Power at 3500 MHz
LMH2100 30014050.gif
Figure 26. Temperature Drift Error (Mean ±3 sigma) vs
RF Input Power at 50 MHz
LMH2100 30014052.gif
Figure 28. Temperature Drift Error (Mean ±3 sigma) vs
RF Input Power at 1855 MHz
LMH2100 30014054.gif
Figure 30. Temperature Drift Error (Mean ±3 sigma) vs
RF Input Power at 3000 MHz
LMH2100 300140a5.gif
Figure 32. Temperature Drift Error (Mean ±3 sigma) vs
RF Input Power at 4000 MHz
LMH2100 30014027.gif
Figure 34. Error for 1 dB Input Power Step vs
RF Input Power at 900 MHz
LMH2100 30014029.gif
Figure 36. Error for 1 dB Input Power Step vs
RF Input Power at 2500 MHz
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Figure 38. Error for 1 dB Input Power Step vs
RF Input Power at 3500 MHz
LMH2100 30014032.gif
Figure 40. Error for 10 dB Input Power Step vs
RF Input Power at 50 MHz
LMH2100 30014034.gif
Figure 42. Error for 10 dB Input Power Step vs
RF Input Power at 1855 MHz
LMH2100 30014036.gif
Figure 44. Error for 10 dB Input Power Step vs
RF Input Power at 3000 MHz
LMH2100 300140a3.gif
Figure 46. Error for 10 dB Input Power step vs
RF Input Power at 4000 MHz
LMH2100 30014039.gif
Figure 48. Mean Temperature Sensitivity vs
RF Input Power at 900 MHz
LMH2100 30014041.gif
Figure 50. Mean Temperature Sensitivity vs
RF Input Power at 2500 MHz
LMH2100 30014043.gif
Figure 52. Mean Temperature Sensitivity vs
RF Input Power at 3500 MHz
LMH2100 30014056_nws020.gif
Figure 54. Temperature Sensitivity (Mean ±3 sigma) vs
RF Input Power at 50 MHz
LMH2100 30014058_nws020.gif
Figure 56. Temperature Sensitivity (Mean ±3 sigma) vs
RF Input Power at 1855 MHz
LMH2100 30014060_nws020.gif
Figure 58. Temperature Sensitivity (Mean ±3 sigma) vs
RF Input Power at 3000 MHz
LMH2100 300140a6_nws020.gif
Figure 60. Temperature Sensitivity (mean ±3 sigma) vs.
RF Input Power at 4000 MHz
LMH2100 30014073.gif
Figure 62. Output Voltage and Log Conformance Error vs
RF Input Power for Various Modulation Types at 1855 MHz
LMH2100 30014045.gif
Figure 64. Output Noise Spectrum vs Frequency
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Figure 66. Output Amplifier Gain and Phase vs Frequency
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Figure 68. Sinking Output Current vs Output Voltage
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Figure 70. Output Voltage vs Sinking Current