11.1 Layout Guidelines

The LMH6551 is a very high performance amplifier. In order to get maximum benefit from the differential circuit architecture, board layout and component selection is very critical. The circuit board should have a low inductance ground plane and well bypassed broad supply lines. External components should be leadless surface mount types. The feedback network and output matching resistors should be composed of short traces and precision resistors (0.1%). The output matching resistors should be placed within 3-4 mm of the amplifier as should the supply bypass capacitors. The LMH730154 evaluation board is an example of good layout techniques.

The LMH6551 is sensitive to parasitic capacitances on the amplifier inputs and to a lesser extent on the outputs as well. Ground and power plane metal should be removed from beneath the amplifier and from beneath R_F and R_G.

With any differential signal path symmetry is very important. Even small amounts of asymmetry will contribute to distortion and balance errors.

Texas Instruments offers evaluation board(s) to aid in device testing and characterization and as a guide for proper layout. Generally, a good high frequency layout will keep power supply and ground traces away from the inverting input and output pins. Parasitic capacitances on these nodes to ground will cause frequency response peaking and possible circuit oscillations.

11.2 Layout Example

Figure 36. Layout Schematic

11.3 Power Dissipation

The LMH6551 is optimized for maximum speed and performance in the small form factor of the standard SOIC package, and is essentially a dual channel amplifier. To ensure maximum output drive and highest performance, thermal shutdown is not provided. Therefore, it is of utmost importance to make sure that the T_JMAXof 150°C is never exceeded due to the overall power dissipation.

Follow these steps to determine the Maximum power dissipation for the LMH6551:

1. Calculate the quiescent (no-load) power:
Equation 1. P_AMP = I_CC* (V_S)
where
• V_S = V⁺ - V⁻

Be sure to include any current through the feedback network if V_OCM is not mid rail.

2. Calculate the RMS power dissipated in each of the output stages:
Equation 2. P_D (rms) = rms ((V_S - V⁺_OUT) * I⁺_OUT) + rms ((V_S − V⁻_OUT) * I⁻_OUT)
where
• V_OUT and I_OUT are the voltage and the current measured at the output pins of the differential amplifier as if they were single-ended amplifiers and V_S is the total supply voltage
3. Calculate the total RMS power:
Equation 3. P_T = P_AMP + P_D.

The maximum power that the LMH6551 package can dissipate at a given temperature can be derived with the following equation:

11.4 ESD Protection

The LMH6551 is protected against electrostatic discharge (ESD) on all pins. The LMH6551 will survive 2000 V Human Body model and 200 V Machine model events. Under normal operation the ESD diodes have no effect on circuit performance. There are occasions, however, when the ESD diodes will be evident. If the LMH6551 is driven by a large signal while the device is powered down the ESD diodes will conduct. The current that flows through the ESD diodes will either exit the chip through the supply pins or will flow through the device, hence it is possible to power up a chip with a large signal applied to the input pins.