SNCS104D April   2005  – December 2014 LMH6570

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics ±5V
    6. 6.6 Electrical Characteristics ±3.3V
    7. 6.7 Typical Performance Characteristics
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Video Performance
      2. 7.2.2 Feedback Resistor Selection
      3. 7.2.3 Multiplexer Expansion
      4. 7.2.4 Other Applications
      5. 7.2.5 Driving Capacitive Loads
      6. 7.2.6 ESD Protection
  8. 8 Power Supply Recommendations
    1. 8.1 Power Dissipation
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Device and Documentation Support

10.1 Documentation Support

10.1.1 Related Documentation

For related documentation, see the following:

  • Current Feedback Loop Gain Analysis and Performance Enhancement, Application Note OA-13 (SNOA366)
  • IC Package Thermal Metrics Application Report (SPRA953)

10.2 Trademarks

All other trademarks are the property of their respective owners.

10.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

10.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.