SNAS888A September   2024  – November 2024 LMK1D2102L , LMK1D2106L

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Common Mode
      2. 8.3.2 Fail-Safe Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 Output Enable / Disable and Amplitude Selection
      2. 8.4.2 LVDS Output Termination
      3. 8.4.3 Input Termination
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RHA|40
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC (1) LMK1D2102L LMK1D2104L LMK1D2106L LMK1D2108L UNIT
VQFN VQFN VQFN VQFN
16 PINS 28 PINS 40 PINS 48 PINS
RθJA Junction-to-ambient thermal resistance  48.7 38.9 30.3 30.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.4 32.1 21.6 21.2 °C/W
RθJB Junction-to-board thermal resistance 23.6 18.7 13.1 12.9 °C/W
ΨJT Junction-to-top characterization parameter 1.6 1 0.4 0.4 °C/W
ΨJB Junction-to-board characterization parameter 23.6 18.7 13 12.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 8.6 8.2 4.5 4.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.