JAJSJG0A May   2020  – January 2021 LMK5B12204

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
    1. 6.1 Device Start-Up Modes
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: 4-Layer JEDEC Standard PCB
    5. 7.5 Thermal Information: 10-Layer Custom PCB
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Output Clock Test Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 ITU-T G.8262 (SyncE) Standards Compliance
    2. 9.2 Functional Block Diagram
      1. 9.2.1 PLL Architecture Overview
      2. 9.2.2 DPLL Mode
      3. 9.2.3 APLL-Only Mode
    3. 9.3 Feature Description
      1. 9.3.1  Oscillator Input (XO_P/N)
      2. 9.3.2  Reference Inputs (PRIREF_P/N and SECREF_P/N)
        1. 9.3.2.1 Programmable Input Hysteresis
      3. 9.3.3  Clock Input Interfacing and Termination
      4. 9.3.4  Reference Input Mux Selection
        1. 9.3.4.1 Automatic Input Selection
        2. 9.3.4.2 Manual Input Selection
      5. 9.3.5  Hitless Switching
        1. 9.3.5.1 Hitless Switching With 1-PPS Inputs
      6. 9.3.6  Gapped Clock Support on Reference Inputs
      7. 9.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 9.3.7.1 XO Input Monitoring
        2. 9.3.7.2 Reference Input Monitoring
          1. 9.3.7.2.1 Reference Validation Timer
          2. 9.3.7.2.2 Amplitude Monitor
          3. 9.3.7.2.3 Frequency Monitoring
          4. 9.3.7.2.4 Missing Pulse Monitor (Late Detect)
          5. 9.3.7.2.5 Runt Pulse Monitor (Early Detect)
          6. 9.3.7.2.6 Phase Valid Monitor for 1-PPS Inputs
        3. 9.3.7.3 PLL Lock Detectors
        4. 9.3.7.4 Tuning Word History
        5. 9.3.7.5 Status Outputs
        6. 9.3.7.6 Interrupt
      8. 9.3.8  PLL Relationships
        1. 9.3.8.1  PLL Frequency Relationships
        2. 9.3.8.2  Analog PLLs (APLL1, APLL2)
        3. 9.3.8.3  APLL Reference Paths
          1. 9.3.8.3.1 APLL XO Doubler
          2. 9.3.8.3.2 APLL1 XO Reference (R) Divider
          3. 9.3.8.3.3 APLL2 Reference (R) Dividers
        4. 9.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 9.3.8.5  APLL Feedback Divider Paths
          1. 9.3.8.5.1 APLL1 N Divider With SDM
          2. 9.3.8.5.2 APLL2 N Divider With SDM
        6. 9.3.8.6  APLL Loop Filters (LF1, LF2)
        7. 9.3.8.7  APLL Voltage Controlled Oscillators (VCO1, VCO2)
          1. 9.3.8.7.1 VCO Calibration
        8. 9.3.8.8  APLL VCO Clock Distribution Paths (P1, P2)
        9. 9.3.8.9  DPLL Reference (R) Divider Paths
        10. 9.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 9.3.8.11 DPLL Loop Filter (DLF)
        12. 9.3.8.12 DPLL Feedback (FB) Divider Path
      9. 9.3.9  Output Clock Distribution
      10. 9.3.10 Output Channel Muxes
      11. 9.3.11 Output Dividers (OD)
      12. 9.3.12 Clock Outputs (OUTx_P/N)
        1. 9.3.12.1 AC-Differential Output (AC-DIFF)
        2. 9.3.12.2 HCSL Output
        3. 9.3.12.3 1.8-V LVCMOS Output
        4. 9.3.12.4 Output Auto-Mute During LOL
      13. 9.3.13 Glitchless Output Clock Start-Up
      14. 9.3.14 Clock Output Interfacing and Termination
      15. 9.3.15 Output Synchronization (SYNC)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Start-Up Modes
        1. 9.4.1.1 EEPROM Mode
        2. 9.4.1.2 ROM Mode
      2. 9.4.2 PLL Operating Modes
        1. 9.4.2.1 Free-Run Mode
        2. 9.4.2.2 Lock Acquisition
        3. 9.4.2.3 Locked Mode
        4. 9.4.2.4 Holdover Mode
      3. 9.4.3 PLL Start-Up Sequence
      4. 9.4.4 Digitally-Controlled Oscillator (DCO) Mode
        1. 9.4.4.1 DCO Frequency Step Size
        2. 9.4.4.2 DCO Direct-Write Mode
    5. 9.5 Programming
      1. 9.5.1 Interface and Control
      2. 9.5.2 I2C Serial Interface
        1. 9.5.2.1 I2C Block Register Transfers
      3. 9.5.3 SPI Serial Interface
        1. 9.5.3.1 SPI Block Register Transfer
      4. 9.5.4 Register Map and EEPROM Map Generation
      5. 9.5.5 General Register Programming Sequence
      6. 9.5.6 EEPROM Programming Flow
        1. 9.5.6.1 EEPROM Programming Using Method #1 (Register Commit)
          1. 9.5.6.1.1 Write SRAM Using Register Commit
          2. 9.5.6.1.2 Program EEPROM
        2. 9.5.6.2 EEPROM Programming Using Method #2 (Direct Writes)
          1. 9.5.6.2.1 Write SRAM Using Direct Writes
          2. 9.5.6.2.2 User-Programmable Fields In EEPROM
      7. 9.5.7 Read SRAM
      8. 9.5.8 Read EEPROM
      9. 9.5.9 EEPROM Start-Up Mode Default Configuration
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Device Start-Up Sequence
      2. 10.1.2 Power Down (PDN) Pin
      3. 10.1.3 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 10.1.3.1 Mixing Supplies
        2. 10.1.3.2 Power-On Reset (POR) Circuit
        3. 10.1.3.3 Powering Up From a Single-Supply Rail
        4. 10.1.3.4 Power Up From Split-Supply Rails
        5. 10.1.3.5 Non-Monotonic or Slow Power-Up Supply Ramp
      4. 10.1.4 Slow or Delayed XO Start-Up
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Bypassing
    2. 11.2 Device Current and Power Consumption
      1. 11.2.1 Current Consumption Calculations
      2. 11.2.2 Power Consumption Calculations
      3. 11.2.3 Example
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Reliability
      1. 12.3.1 Support for PCB Temperature up to 105 °C
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 TICS Pro
      2. 13.1.2 Related Documentation
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 用語集
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
      1. 14.1.1 Packaging Information
      2. 14.1.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.3 Do's and Don'ts

  • Power all the VDD pins with proper supply decoupling and bypassing connect as shown in Figure 10-4.
  • Power down unused blocks through registers to minimize power consumption.
  • Use proper source or load terminations to match the impedance of input and output clock traces for any active signals to/from the device.
  • Leave unused clock outputs floating and powered down through register control.
  • Leave unused clock inputs floating.
  • For EEPROM+SPI Mode: Leave HW_SW_CTRL and STATUS[1:0] pins floating during POR to ensure proper start-up. These pins has internal biasing to VIM internally.
    • If HW_SW_CTRL or either STATUS pin is connected to a system host (MCU or FPGA), the host device must be configured with high-impedance input (no pullup or pulldown resistors) to avoid conflict with the internal bias to VIM. If needed, external biasing resistors (10-kΩ pullup to 3.3 V and 3.3-kΩ pulldown) can be connected on each STATUS pin to bias the inputs to VIM during POR.
  • Consider routing each STATUS pin to a test point or high-impedance input of a host device to monitor device status outputs.
  • Consider using a LDO regulator to power the external XO/TCXO/OCXO source.
    • High jitter and spurious outputs on the oscillator clock are often caused by high spectral noise and ripple on the power supply.
  • Include dedicated header to access the I2C or SPI interface of the device, as well as a header pin for ground.
    • This can enabled off-board programming for device bring-up, prototyping, and diagnostics using the TI USB2ANY interface and TICS Pro software tools.