SNOSAI9I September   2005  – November 2015 LMP7701 , LMP7702 , LMP7704

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics 3-V
    6. 7.6 Electrical Characteristics 5-V
    7. 7.7 Electrical Characteristics ±5-V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Capacitive Load
      2. 8.3.2 Input Capacitance
      3. 8.3.3 Diodes Between the Inputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Precision Current Source
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Low Input Voltage Noise
      2. 9.1.2 Total Noise Contribution
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

11 Layout

11.1 Layout Guidelines

Take care to minimize the loop area formed by the bypass capacitor connection between supply pins and ground. A ground plane underneath the device is recommended; any bypass components to ground should have a nearby via to the ground plane. The optimum bypass capacitor placement is closest to the corresponding supply pin. Use of thicker traces from the bypass capacitors to the corresponding supply pins will lower the power supply inductance and provide a more stable power supply.

The feedback components should be placed as close to the device as possible to minimize stray parasitics.

11.2 Layout Example

LMP7701 LMP7702 LMP7704 layout_SNOSAI9.gif Figure 52. LMP7701 Example Layout