JAJSKX8C December   2020  – March 2022 LMP7704-SP

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 5 V
    6. 6.6 Electrical Characteristics: VS = 10 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Radiation Hardened Performance
      2. 7.3.2 Engineering Model (Devices With /EM Suffix)
      3. 7.3.3 Capacitive Load
      4. 7.3.4 Input Capacitance
      5. 7.3.5 Diodes Between the Inputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Precision Current Source
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Low Input Voltage Noise
      2. 8.1.2 Total Noise Contribution
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3.2 Engineering Model (Devices With /EM Suffix)

Engineering evaluation or engineering model (EM) devices are available for order and are identified by the /EM in the orderable device name (see the Ordering Information table on the front page of the data sheet). These devices meet the performance specifications of the data sheet at room temperature only and have not received the full space production flow or testing. Engineering samples may be QCI rejects that failed tests that would not impact the performance at room temperature, such as radiation or reliability testing.