SNOSCX0A June   2013  – December 2014 LMP92064

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Sense Input Channel
      2. 7.3.2 Current Sense Input Channel Common-Mode and Differential Voltage Range (Dynamic Range Considerations)
      3. 7.3.3 Voltage Sense Input Channel
      4. 7.3.4 Reference
      5. 7.3.5 Reset
      6. 7.3.6 Device Power-Up Sequence
    4. 7.4 Device Functional Modes
      1. 7.4.1 ADC Operation
    5. 7.5 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Digital Isolators
        2. 8.2.2.2 Supply Voltage for the LMP92064
        3. 8.2.2.3 Series Resistor for the Shunt Regulator
        4. 8.2.2.4 Voltage Channel Input Resistor Divider
        5. 8.2.2.5 Sense Resistor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Current Input Error Sources
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from * Revision (June 2013) to A Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go