JAJSR90A September 2023 – July 2024 LMQ64480-Q1 , LMQ644A0-Q1 , LMQ644A2-Q1
PRODUCTION DATA
100% automated visual inspection (AVI) post-assembly is typically required to meet requirements for high reliability and robustness. Optimized QFN packages do not have solderable or exposed pins and terminals that are easily viewed. It is therefore difficult to visually determine whether or not the package is successfully soldered onto the printed-circuit board (PCB). The wettable-flank process was developed to resolve the issue of side-lead wetting of leadless packaging. The LMQ644xx-Q1 is assembled using a 24-pin Enhanced HotRod QFN package with wettable flanks to provide a visual indicator of solderability, which reduces the inspection time and manufacturing costs.