JAJSN93B January   2022  – September 2023 LMR38010

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency Peak Current Mode Control
      2. 8.3.2  Adjustable Output Voltage
      3. 8.3.3  Enable
      4. 8.3.4  Switching Frequency and Synchronization (RT/SYNC)
      5. 8.3.5  Power-Good Flag Output
      6. 8.3.6  Minimum On Time, Minimum Off Time, and Frequency Foldback
      7. 8.3.7  Bootstrap Voltage
      8. 8.3.8  Overcurrent and Short Circuit Protection
      9. 8.3.9  Soft Start
      10. 8.3.10 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Forced PWM Operation
      3. 8.4.3 Dropout
      4. 8.4.4 Minimum Switch On Time
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Choosing the Switching Frequency
        3. 9.2.2.3 FB for Adjustable Output
        4. 9.2.2.4 Inductor Selection
        5. 9.2.2.5 Output Capacitor Selection
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 CBOOT
        8. 9.2.2.8 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Ground and Thermal Considerations
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
      2. 10.1.2 サード・パーティ製品に関する免責事項
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 静電気放電に関する注意事項
    7. 10.7 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) LMR38010 UNIT
DDA (HSOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 42.9 °C/W
RθJA(Effecitve) Junction-to-ambient thermal resistance with TI EVM board 29 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54 °C/W
RθJB Junction-to-board thermal resistance 13.6 °C/W
ψJT Junction-to-top characterization parameter 4.3 °C/W
ψJB Junction-to-board characterization parameter 13.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.