For related documentation see the
following:
- Texas Instruments, Thermal Design by Insight not
Hindsight application report
- Texas Instruments, A Guide to Board Layout for
Best Thermal Resistance for Exposed Pad
Packages application report
- Texas Instruments, Semiconductor and IC Package
Thermal Metrics application report
- Texas Instruments, Thermal Design Made Simple
with LM43603 and LM43602 application
report
- Texas Instruments, PowerPAD™ Thermally
Enhanced Package application
report
- Texas Instruments, PowerPAD™ Made
Easy application report
- Texas Instruments, Using New Thermal Metrics
application report
- Texas Instruments, Layout Guidelines for
Switching Power Supplies application
report
- Texas Instruments, Simple Switcher PCB Layout
Guidelines application report
- Texas Instruments, Construction Your Power Supply- Layout Considerations
Seminar
- Texas Instruments, Low Radiated EMI Layout Made
Simple with LM4360x and LM4600x application
report