SNAS850
December 2024
LMX1205
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements
5.7
Timing Diagram
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.1.1
Range of Dividers and Multiplier
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Power On Reset
6.3.2
Temperature Sensor
6.3.3
Clock Input
6.3.3.1
Clock Input Adjustable Delay
6.3.4
Clock Outputs
6.3.4.1
Clock Output Buffers
6.3.4.2
Clock Output Adjustable Delay
6.3.4.3
Clock MUX
6.3.4.4
Clock Divider
6.3.4.5
Clock Multiplier
6.3.4.5.1
General Information About the Clock Multiplier
6.3.4.5.2
State Machine Clock for the Clock Multiplier
6.3.4.5.2.1
State Machine Clock
6.3.4.5.3
Calibration for the Clock Multiplier
6.3.4.5.4
Lock Detect for the Clock Multiplier
6.3.5
LOGICLK Outputs
6.3.5.1
LOGICLK Output Format
6.3.5.2
LOGICLK Dividers
6.3.6
SYSREF
6.3.6.1
SYSREF Output Buffers
6.3.6.1.1
SYSREF Output Buffers for Main Clocks (SYSREFOUT)
6.3.6.1.2
LOGISYSREF Output Buffer
6.3.6.1.3
SYSREF Frequency and Delay Generation
6.3.6.1.4
SYSREFREQ Pins and SYSREFREQ SPI Controlled Fields
6.3.6.1.4.1
SYSREFREQ Pins Common-Mode Voltage
6.3.6.1.4.2
SYSREFREQ Windowing Feature
6.3.6.1.4.2.1
General Procedure Flowchart for SYSREF Windowing Operation
6.3.6.1.4.2.2
Other Guidance For SYSREF Windowing
6.3.6.1.4.2.3
For Glitch-Free Output
6.3.6.1.4.2.4
If Using SYNC Feature
6.3.6.1.4.2.5
SYNC Feature
6.3.7
Power-Up Timing
6.3.8
Treatment of Unused Pins
6.4
Device Functional Modes Configurations
7
Register Map
7.1
Device Registers
8
Application and Implementation
8.1
Reference
8.1.1
Typical Application
8.1.1.1
Design Requirements
8.1.1.2
Detailed Design Procedure
8.1.1.3
Application Plots
8.2
Power Supply Recommendations
8.3
Layout
8.3.1
Layout Guidelines
8.3.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
RHA|40
MPQF135D
サーマルパッド・メカニカル・データ
RHA|40
QFND650
発注情報
snas850_oa
9.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.